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NEWS TAGGED CHIPBOND
Friday 2 July 2010
Renesas raises outsourcing to Taiwan partners, says paper
Renesas Electronics has raised its orders to Powerchip Technology for its LCD driver ICs, and also grown its outsourcing to backend partner Chipbond Technology, according to a recent...
Tuesday 29 June 2010
Chipbond to buy new testers; 2010 capex to reach NT$2 billion
Chipbond Technology has announced it plans to spend NT$2 billion (US$62 million) in capex this year, an upward revision from its originally-planned NT$1.5 billion. The LCD driver-IC...
Monday 28 June 2010
Chipbond looks to 10% sequential revenue growth in 3Q10
LCD driver-IC packaging and testing house Chipbond Technology expects revenues for the third quarter of 2010 to grow by 10% on quarter, chairman Fei-Jain Wu said at the company's...
Wednesday 23 June 2010
Driver IC packager Chipbond at almost full capacity on strong demand ahead of holiday season
Chipbond Technology has revealed it is currently running at near full capacity for COF (chip-on-film) and COG (chip-on-glass), and utilization for bumping has risen to 85-90%. Customers...
Monday 7 June 2010
Chipbond to raise stake in China affiliate
Chipbond Technology has filed an application with the Taiwan government to take up a majority stake in China-based Chipmore Technology, which it now owns almost 20%, according to...
Friday 23 April 2010
Chipbond sees profits in 1Q10
LCD driver IC packaging house Chipbond Technology has announced net profits of NT$398 million (US$13 million) or NT$1.20 per share, for the first quarter of 2010, compared with losses...
Thursday 8 April 2010
Chipbond sees 1Q10 revenues beat guidance
Chipbond Technology has reported revenues of NT$801 million (US$25 million) for March 2010, with revenues for the first quarter beating its previous estimates. The LCD driver IC packaging...
Friday 2 April 2010
Prices for LCD driver IC backend services to rise in 2Q10
LCD driver IC packaging and testing house Chipbond Technology is integrating the different quotes offered by it and International Semiconductor Technology (IST) before their merger,...
Thursday 1 April 2010
Chipbond completes merger with peer IST
LCD driver IC packaging house Chipbond Technology announced on April 1 the completion of its merger with International Semiconductor Technology (IST), with Chipbond being the surviving...
Monday 1 March 2010
SPIL to drop out from LCD driver IC, DRAM segments; sell related equipment to ChipMOS
Siliconware Precision Industries (SPIL) has announced that it will take a 15.8% stake in ChipMOS Technologies in exchange for all of its of LCD driver IC packaging and testing equipment...
Friday 26 February 2010
Chipbond seeing high utilization rates
LCD driver IC backend house Chipbond Technology has stated that its utilization rates for the ongoing first quarter has returned to the high levels recorded in the third quarter of...
Thursday 11 February 2010
Chipbond sees January 2010 sales up 24% on month
Chipbond Technology has announced revenues for January 2010 grew 23.61% sequentially to NT$608 million (US$18.93 million). The LCD driver IC packaging and testing house projected...
Wednesday 27 January 2010
Driver IC backend supply to tighten, says Chipbond chairman
Fei-Jain Wu, chairman of driver-IC backend house Chipbond Technology, has predicted that demand for wafer probe testing will exceed supply in March 2010. Wu also believes a similar...
Tuesday 26 January 2010
Chipbond capex to more than double in 2010
Chipbond Technology has set a capex goal of NT$1.5 billion (US$47 million) for 2010 compared to NT$700 million allocated for the previous year, according to company chairman Fei-Jain...
Wednesday 20 January 2010
Chipbond, IST merger may complete ahead of schedule
LCD driver IC packaging house Chipbond Technology has said its merger with International Semiconductor Technology (IST) may be finalized on April 1, 2010 at the earliest. The merger...
Holtek
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research