Taiwan's LCD driver IC backend service suppliers have seen order visibility extend to October, driven by increased orders from China's LCD TV market due to the government's expanded...
LCD driver IC makers are being hit by tight packaging capacity at back-end service suppliers due to a shortage of chip on film (COF) tapes, according to industry sources.
Chipbond Technology, International Semiconductor Technology (IST) and King Yuan Electronics Company (KYEC) may increase the quotes for their driver IC backend services in July 2009...
Taiwan-based backend service providers Chipbond Technology and King Yuan Electronics (KYEC) have announced narrower revenue drops on year in April compared to those in the first three...
Driver IC packaging and testing companies Chipbond Technology and International Semiconductor Technology (IST) are likely to enjoy revenue growth of more than 80% sequentially in...
Taiwan-based LCD driver IC packaging and testing houses are expected to see their fabs running at full capacity by the end of the second quarter, as more Japan-based IDMs have begun...
Driver IC packaging and testing companies Chipbond Technology, International Semiconductor Technology (IST) and King Yuan Electronics Company (KYEC) have seen their recently capacity...
Most packaging and testing houses, including Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industry (SPIL), saw significant increases in sales in February, thanks...
Driver IC packaging and testing companies Chipbond Technology, ChipMOS Technologies and King Yuan Electronics Company (KYEC) recently have been able to receive mostly rush or short-term...
Driver IC packaging and testing house Chipbond Technology's November sales were only NT$277 million (US$8.32 million), down 36% from October and lower than the company's breakeven...
Backend packaging and testing company Chipbond Technology is facing difficulties with a utilization rate of only 50% currently mainly due to the impact of weak panel demand on the...
Driver IC packaging and testing houses Chipbond Technology, International Semiconductor Technology (IST), and ChipMOS Technologies will see their utilization rates drop to 55-60%...
Driver IC maker Novatek Microelectronics has reported decline in third-quarter sales due to reductions in output a panel makers. Chipbond Technology also failed to meet third-quarter...
As most upstream LCD panel and LCD driver IC vendors are guiding for a conservative second half of 2008, major LCD driver IC packaging and testing houses' expect to feel the effect...
Chipbond Technology is facing stronger resistance from clients to its planned increases in driver IC packaging and testing quotes, as the LCD panel market is turning more conservative...
