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Driver IC packaging firms see capacity utilization improve on China demand

Ingrid Lee, Taipei; Jessie Shen, DIGITIMES Asia Thursday 19 March 2009 0

Driver IC packaging and testing companies Chipbond Technology, International Semiconductor Technology (IST) and King Yuan Electronics Company (KYEC) have seen their recently capacity utilization rates climb to 40-50%, compared to 30-40% before the Lunar...

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