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Driver IC packaging and testing houses to see utilization drop to 55-66% in 4Q08

Ingrid Lee, Taipei; Rodney Chan, DIGITIMES Asia Wednesday 5 November 2008 0

Driver IC packaging and testing houses Chipbond Technology, International Semiconductor Technology (IST), and ChipMOS Technologies will see their utilization rates drop to 55-60% in the fourth quarter from 60-70% in the third, as the LCD panel industry...

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