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NEWS TAGGED CHIPBOND
Wednesday 13 January 2010
LCD driver IC backend houses considering raising quotes
LCD driver IC packaging and testing houses are considering raising their quotes soon in part due to tight production resulting from a surge in demand and in part due to persistent...
Wednesday 30 December 2009
Taiwan likely to lift cross-strait ban on backend semiconductor technology soon
The Taiwan government will likely lift a ban on local firms setting up more advanced packaging and testing operations in China in early 2010, according to market sources. The government...
Monday 28 December 2009
Chipbond-IST merger set to complete in June 2010
LCD driver IC packaging house International Semiconductor Technology (IST) has announced that its board of directors on December 25 approved a deal to merge with Chipbond Technology,...
Thursday 17 December 2009
Taiwan IC backend industry to see more consolidation in 2010, says TICP chairman
The Taiwan IC packaging and testing industry will continue to consolidate in 2010, in the wake of Chipbond Technology's recently-announced merger with counterpart International Semiconductor...
Tuesday 8 December 2009
IST merger to further lighten non-operating investment burden for Compal
The merger of Chipbond Technology and International Semiconductor Technology (IST) is expected to help the Compal Group turn its investment in IST from a loss to profit, according...
Monday 7 December 2009
Chipbond and IST announce merger
Driver IC packaging houses Chipbond Technology and International Semiconductor Technology (IST) today (December 7) announced a merger through a stock swap.
Wednesday 2 December 2009
Chipbond eyes outsourcing COF substrate orders from Mitsui subsidiary
Chipbond Technology has disclosed it is negotiating an outsourcing deal with MCS, a subsidiary of Japan-based Mitsui Kinzoku. Both parties have been evaluating the possibility of...
Wednesday 2 December 2009
Chipbond, IST deny merger rumors
LCD driver IC packaging and testing houses Chipbond Technology and International Semiconductor Technology (IST) have both dismissed recent rumors that the two companies plan to merge...
Friday 20 November 2009
Chipbond likely to miss revenue guidance for 4Q09, say watchers
LCD driver IC packaging and testing house Chipbond Technology may see fourth-quarter 2009 revenues decline by up to 30% sequentially, as customers' inventory levels are still high,...
Thursday 19 November 2009
One too many LCD driver IC backend service providers in Taiwan, says Chipbond
Taiwan-based Chipbond Technology has commented that reducing the number of the local LCD driver IC packaging and testing houses to three through acquisitions or mergers will help...
Monday 16 November 2009
Chipbond affiliate in China suspends expansion plan pending rule changes
Chipbond Technology's China-based affiliate Chipmore Technology has suspended plans to expand capacity for gold bumping, pending possible changes to Taiwan government policies concerning...
Friday 6 November 2009
Driver IC backend supplier revenues down in October 2009
Driver IC backend supplier Chipbond Technology saw its October revenues decline by 25.2% to NT$468 million (US$13.39 million) as customers have slowed down their pace of orders, according...
Thursday 5 November 2009
Chipbond and IST 4Q09 revenues to drop 20% on quarter
Chipbond Technology and International Semiconductor Technology (IST) may see sequential revenue drops of almost 20% in the fourth quarter of 2009, in accordance with driver IC design...
Monday 26 October 2009
Chipbond 3Q09 profits up three-fold
LCD driver IC packaging and testing house Chipbond Technology enjoyed a net profit of NT$319 million (US$9.85 million), or NT$1.03 per share in the third quarter of 2009, compared...
Friday 9 October 2009
Chipbond and IST return to on-year growth in 3Q09
LCD driver IC packaging and testing firm Chipbond Technology saw revenues amount to NT$1.88 billion (US$58.4 million) in the third quarter of 2009, a 4.4% on-year increase compared...
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