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Tuesday 16 July 2024
PCB shipments for LEO satellites to ramp up
Low Earth orbit (LEO) satellite services are reaching an ever-widening global user base as the space industry becomes increasingly commercialized. SpaceX's Starlink system has gained...
Tuesday 16 July 2024
China's self-sufficiency for automotive ICs still below 10%
Despite having the biggest car market in the world and the largest capacity for making Electric Vehicles (EV), China's automotive semiconductor self-sufficiency rate remains below...
Tuesday 16 July 2024
China's uphill battle for IC self-sufficiency amid fast-paced tech landscape
While China has made progress in some mature processes, it still has a long way to go before reaching IC self-sufficiency, according to industry sources.
Tuesday 16 July 2024
TSMC to see 2H24 revenue boost from 3nm chip orders
A ramp-up in 3nm chip orders from Intel may serve as a significant catalyst for TSMC's revenue growth in the latter half of 2024, according to industry sources.
Tuesday 16 July 2024
Samsung HBM3E to obtain verification for volume shipments, say sources
Samsung Electronics' HBM3E memory will soon obtain verification for volume shipments, potentially limiting the vendor's supply of DDR5 and other memory chips, according to industry...
Monday 15 July 2024
JEDEC nears HBM4 standard finalization
The JEDEC Solid State Technology Association has announced that it is nearing completion of the next version of its highly anticipated High Bandwidth Memory (HBM) DRAM standard.
Monday 15 July 2024
Sovereign AI global race: can Tsinghua Unigroup secure China's supremacy?
Ever since Nvidia CEO Jensen Huang championed the "Sovereign AI" strategy at the 2024 World Government Summit, global governments have been in a rush to establish their own AI infrastructure...
Monday 15 July 2024
WAIC 2024 participants expect Chinese domestic AI inference chips to flourish
The 2024 World Artificial Intelligence Conference (WAIC) held in early July reflects a deep conviction of participants in the power of change brought by the Large Language Model (LLM)...
Monday 15 July 2024
RISC-V and other challenges lie ahead as Arm takes on x86
Recent years have seen shakeups in the traditional dichotomy of the processor landscape, in which Arm ruled the mobile market with its low power consumption and cost, while Intel...
Monday 15 July 2024
Samsung leverages IDM status to differentiate HBM4 with optimal customization and performance gains
Samsung is set to launch its sixth generation of High-Bandwidth Memory (HBM), HBM4, in 2025 and will differentiate its HBM technology through customized optimization services by leveraging...
Monday 15 July 2024
Weekly news roundup: Chinese brands dominate domestic smartphone and TV markets; Taiwan fab toolmakers grab major orders
These are the most-read DIGITIMES Asia stories in the week of July 8 – July 12.
Monday 15 July 2024
ISE Labs doubles lab space and capabilities with 2nd Silicon Valley facility
ISE Labs, a subsidiary of ASE that provides one-stop semiconductor engineering services, has announced the expansion of its world-class capabilities with the launch of a second US...
Monday 15 July 2024
India roundup: Indian startup and semiconductor titans team up to bridge skill gap
India's semiconductor ecosystem is rapidly growing as international and local firms are expanding investments in the country.
Monday 15 July 2024
Micron CEO meets Taiwan President, secures government support for local operations
Sanjay Mehrotra, CEO of US memory chip vendor Micron Technology, recently visited Taiwan accompanied by other senior executives from the company. During the tour, Mehrotra and Taiwan's...
Monday 15 July 2024
Building the new generation of AI computing: SoftBank officially acquire Graphcore, eyes UK workforce expansion
At a press conference on July 11, UK-based AI accelerator designer Graphcore confirmed its acquisition by Japan's SoftBank Group.