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NEWS TAGGED CHIPS + COMPONENTS
Thursday 11 July 2024
AI to boost chip component demand, say IC distributors
IC distributors are optimistic about AI-related chip and component demand, predicting a stronger second half of the year than the first. According to industry sources, consumer products,...
Wednesday 10 July 2024
Screen targets doubling sales in a decade with expanded R&D and capital expenditure plans
Screen unveils its three-year mid-term business plan, aiming to increase its overseas R&D spending to address advancements in semiconductor process miniaturization, while also...
Wednesday 10 July 2024
TSMC sales surge past expectations on AI infrastructure demand
Taiwan Semiconductor Manufacturing Co.'s second-quarter sales were buoyed by the AI boom that's fueling data center investment worldwide.
Wednesday 10 July 2024
Applied Materials unveils material breakthroughs for chip miniaturization and energy-efficient computing
Applied Materials introduced the industry's first use of ruthenium in high-volume production, enabling copper chip wiring to scale to the 2nm node and beyond while reducing resistance...
Wednesday 10 July 2024
Alternative to Nvidia: expert highlights gaps in China's domestic AI chip ecosystem
The US government's export ban on Nvidia's high-end AI chips has spurred efforts in China to produce domestic AI chips to meet the burgeoning demand in the country's AI sector.
Wednesday 10 July 2024
Silicon Motion expects 2Q24 sales to beat guidance
Silicon Motion Technology, a manufacturer of NAND flash controllers for solid-state storage devices, has announced that based on preliminary second-quarter financial results, sequential...
Wednesday 10 July 2024
TSMC records 30% YoY growth in sales, Q2 revenue exceeding guidance
TSMC recorded its financial performance in line with market expectations, with consolidated revenue in June at NT$207.869 billion, down 9.5% month-on-month but up 32.9% compared to...
Wednesday 10 July 2024
Samsung and SK Hynix set to introduce new HBM wafer debonding technology
Samsung Electronics and SK Hynix are investing in R&D of new process technologies to prevent warpage in next-generation high-bandwidth memory (HBM). This move is anticipated to...
Wednesday 10 July 2024
Chinese and South Korean SiC tool makers make efforts to cut dependence on Aixtron
In the 2024 SiC Semiconductor Conference held in Pusan in late June 2024, Chinese and South Korean fab tool makers announced SiC MOCVD-related technologies, trying to challenge the...
Wednesday 10 July 2024
Semiconductor manufacturing equipment growth to set new high in 2025: SEMI
Global sales of total semiconductor manufacturing equipment by original equipment manufacturers are forecast to set a new industry record, reaching $109 billion in 2024, growing 3.4%...
Wednesday 10 July 2024
Rising HBM demand to benefit SK Hynix supplier in China
Yoke Technology, a China-based semiconductor and chemical material supplier, has disclosed its preliminary financial results for the first half of 2024. The company expects a net...
Wednesday 10 July 2024
Parade expects growing revenue from increasing adoption of AI PCs
Given the mixed but generally favorable views on Copilot+ PCs, PC vendors are optimistic about the upcoming peak season. This is positive news for IC design companies like Parade...
Wednesday 10 July 2024
Samsung reportedly adopts Mo in 3D NAND, to reshape memory industry
Samsung Electronics is reportedly adopting Molybdenum (Mo) for the metal wiring process in its ninth-generation 3D NAND (V9 NAND) technology.
Wednesday 10 July 2024
Smart grids boost power semiconductor demand
The transformation of smart grids has boosted demand for power semiconductors, nurturing Chinese and Taiwanese suppliers to accelerate R&D of relevant product lines such as thyristors,...
Wednesday 10 July 2024
US to invest up to US$1.6 billion to award domestic semiconductor advanced packaging R&D efforts
On July 9, the US Department of Commerce issued a Notice...