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Tuesday 27 August 2024
Acme seeks new applications for SiC powder amid EV market slowdown
Taiwan's Acme Electronics is anticipating flat or slightly declining demand for its silicon carbide (SiC) powders used in electric vehicles (EVs) during the second half of 2024. To...
Tuesday 27 August 2024
Manz AG anticipates growth in advanced packaging amid CoWoS shortage
The semiconductor industry is experiencing a surge in demand for advanced packaging technologies, driven by the rapid growth of high-end AI servers and generative AI. This trend has...
Tuesday 27 August 2024
China-based OSAT major delivers strong performance in 1H24
JCET, a leading Chinese semiconductor packaging and testing services provider, has announced impressive financial performance for the first half of 2024. The company reported a significant...
Tuesday 27 August 2024
Taiwan-based lead frame manufacturers pivot to AI and automotive sectors amid recovery
Taiwan's lead frame manufacturers are showing signs of recovery, with a strategic focus on high-margin industries such as automotive electronics and high-end servers to boost profitability...
Monday 26 August 2024
Longsys-Kingston joint venture stalls, Shanghai plant sale in limbo
The partnership between memory giants Longsys and Kingston seems to have hit a major snag.
Monday 26 August 2024
Kaynes SemiCon secures India's first paying OSAT customer for advanced semiconductor packaging
Kaynes SemiCon, a wholly owned subsidiary of Kaynes Technology, has signed a landmark memorandum of understanding (MoU) with Lightspeed Photonics, securing India's first paying customer...
Monday 26 August 2024
Former TSMC executive set to depart Samsung after two years as advanced packaging division restructures
In early 2023, Samsung Electronics welcomed former TSMC deputy director Jing-cheng "Vic" Lin to lead an advanced packaging task force to compete against TSMC. However, industry insiders...
Monday 26 August 2024
MCU industry faces diverging fortunes in China and Taiwan
As the traditional peak season for MCU production approaches in the third quarter, the industry's outlook is characterized by a stark contrast between China and Taiwan. While Chinese...
Monday 26 August 2024
TSMC Kumamoto branch shows investment efficiency, expands general manufacturing
Three years since the Japanese government's decision in 2021 to support Taiwan's large foundry company, TSMC, in establishing a factory in Kumamoto, Kyushu has not only seen growth...
Monday 26 August 2024
Weekly news roundup: Intel's 18A under fire for yield; US Chips Act scale now bigger than China Big Fund II
These are the most-read DIGITIMES Asia stories in the week of August 19 – August 23.
Monday 26 August 2024
Nankai Trough earthquake threatens Japan's semiconductor industry
A major earthquake struck off the coast of Miyazaki Prefecture, Japan, on August 8. Although the industrial impact was relatively minor, the Japanese government warned that this event...
Monday 26 August 2024
Kioxia files for October IPO on Tokyo Stock Exchange
Kioxia, a leading Japanese NAND flash memory manufacturer, has filed for an initial public offering (IPO) on the Tokyo Stock Exchange. This highly anticipated IPO is slated for October...
Monday 26 August 2024
India roundup: India sees healthy PC demand in 2Q24
As global PC vendors are grappling with high inventories, India experienced healthy growth in PC shipment. The Indian government may focus on compound semiconductors and silicon photonics...
Monday 26 August 2024
SEMICON Taiwan 2024 achieves record scale; dozens of industry leaders set to give keynote speeches
SEMICON Taiwan 2024, is set to take place on September 4, with over 200 industry leaders from the global high-tech and semiconductor sectors expected to attend.
Friday 23 August 2024
AMD to shift R&D centers to southern Taiwan due to northern power supply constraints
AMD is reportedly shifting its R&D centers away from north and central Taiwan due to power supply concerns. On the afternoon of the 21st, Senior VP of AMD, Mark Fuselier, led...