After Nvidia confirmed the on-schedule shipment of its latest Blackwell GPUs, high-bandwidth memory (HBM) providers, including SK Hynix and Samsung Electronics, expressed relief as...
The global expansion of semiconductor advanced packaging capacity is just beginning, which is promising enormous business opportunities for equipment suppliers, such as the G2C+ alliance...
China's largest pure-play foundry, SMIC, reported a significant decline in profitability despite revenue growth in its latest financial results. The company remains cautious despite...
Nvidia's widely anticipated financial statement for the second quarter of fiscal year 2025 (up until July 28) has been announced. Its revenue has once again exceeded the financial...
Major players in Nvidia's supply chain, such as global foundry leader TSMC, have good order visibility extending to 2026, despite stock investors' concern about the US chip vendor's...
August 28 marked the 100th day since Vice Chairman Young Hyun Jun was appointed as the new Head of the Device Solutions (DS) Division at Samsung Electronics. The South Korean industry's...
YTEC, a Taiwan-based technology company, has strategically pivoted its business focus in response to changing market dynamics. Facing a decline in demand for optoelectronic LEDs,...
Panel-level packaging (PLP) is promising to become a viable choice due to its cost-effectiveness and insufficient capacity for advanced chip packaging in the semiconductor industry...
Despite delivering a strong performance that exceeded estimates, Nvidia's guidance fell short of the lofty expectations held by those anticipating an unabated AI boom. Analysts believe...
Amid speculation about potential shipment delays for Blackwell, Nvidia has confirmed making minor adjustments to the GPU mask and now anticipates shipments to begin in the fourth...
In recent years, advanced packaging has become increasingly crucial in high-performance computing, and Chinese OSAT companies, particularly Tongfu Microelectronics, are determined...
