TSMC has taken targeted measures to boost its support for Taiwan's domestic supply chain, reduce costs, and reduce the risks associated with foreign monopolies. These efforts are...
China-based semiconductor equipment manufacturers have expedited their domestic development efforts, foraying into the chiplet and HBM memory sectors, according to industry sources...
Intel recently released a disappointing earnings report, revealing declines in both revenue and operating margin. The company announced comprehensive cost-cutting plans, including...
South Korea's archery teams captured gold in both men's and women's events at the Paris 2024 Olympics, but their success wasn't just due to traditional training methods. Behind their...
Reports indicate that China's DRAM leader ChangXin Memory Technologies (CXMT) is actively investing in high bandwidth memory (HBM) production capacity. Currently, CXMT is establishing...
Taiwan-based IC equipment maker Trusval Technology, a supplier of TSMC, has benefited from its recent expansion into system integration engineering services. It has successfully captured...
Indian opto-semiconductor supplier Polymatech has announced the acquisition of a US-based semiconductor equipment provider specializing in packaging and testing. This...
Innolux has selected FOPLP as the primary driver of its transformation from an LCD panel maker to a semiconductor firm and is getting ready for market growth, according to company...
Taiwan's chipmaking tool exports, which prioritize the market in China, have been impacted by China's increased efforts to achieve self-sufficiency in semiconductor equipment.
The US government is considering imposing restrictions as early as August to restrict China's access to crucial High Bandwidth Memory (HBM) chips and related manufacturing equipment...
Japan has implemented additional tax incentives and other measures to vigorously pursue ambitious efforts aimed at rebuilding its semiconductor industry.
Chang Wah Electromaterials (CWE), a Taiwanese supplier of semiconductor and electronics materials and equipment, is transitioning from 12-inch wafer-level packaging to panel-level...
ACM Research has introduced its Ultra C vac-p flux cleaning equipment, specifically designed for fan-out panel-level packaging (FOPLP). This new tool employs vacuum technology to...
China is ramping up its efforts to produce High-Bandwidth Memory (HBM), crucial for advancing AI technology, as part of its supply chain indigenization strategy.
