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Tuesday 18 June 2024
FitTech faces challenges, seeks opportunities with TSMC's advanced packaging
The Mini LED demand in the LED industry has shown a lack of new momentum, leading to a halt in expansion plans, and impacting equipment supplier FitTech's operations.
Monday 17 June 2024
Fab tool and equipment suppliers benefit from TSMC 2H24 business boom
TSMC's second-quarter sales may surpass the target, seeing customers' AI and HPC-related orders flowing in. In July, chips for Apple's iPhone 16 and Intel's 3nm chips will start mass...
Thursday 13 June 2024
China accounts for half of Japan's chip equipment exports for 3 quarters in a row
China's demand for Japanese semiconductor equipment has been growing rapidly amidst the export sanction imposed by the US on advanced semiconductor equipment and technologies.
Thursday 6 June 2024
Imec, ASML open joint lithography lab
Imec and ASML have jointly announced the inauguration of a High NA EUV lithography lab in Veldhoven, the Netherlands. This lab is operated jointly by the two companies.
Tuesday 4 June 2024
Laying groundwork for panel-level packaging processes, Manz deepens deployment in advanced semiconductor packaging blue ocean
As the Artificial Intelligence (AI) and High-Performance Computing (HPC) markets continue to rapidly grow, the semiconductor industry is racing to satisfy customer needs with advanced...
Thursday 30 May 2024
Sony adjusts CIS production expansion schedule; equipment investment reduced for next three years
Sony's semiconductor business division, primarily focused on CMOS Image Sensors (CIS), plans to reduce its equipment investment amount in the next three fiscal years from 2024 to...
Thursday 30 May 2024
Malaysia plots US$5.3 billion roadmap to build advanced chip ecosystem
Malaysian Prime Minister Anwar Ibrahim announced the National Semiconductor Strategy (NSS), with the government allocating MYR25 billion (US$5.3 billion) to foster industry develop...
Wednesday 29 May 2024
MEAN WELL showcases power supply expertise at COMPUTEX to support industry's carbon reduction goals
As the world strives to achieve the vision of net-zero carbon emissions, improving energy efficiency has become more important than ever. Eris Wu, Chief Technical Service Officer...
Tuesday 28 May 2024
Micron reportedly plans to produce advanced DRAM in Japan by the end of 2027
Micron, which has a DRAM factory in Hiroshima Prefecture, Japan, is reportedly planning to construct a new plant adjacent to the existing Hiroshima factory as early as 2026.
Tuesday 28 May 2024
Russia to produce 350nm chips with its self-developed lithography machines in 2024, says Chinese media
Vasily Shpak, Deputy Minister of Industry and Trade of the Russian Federation, was quoted by Ijiwei, a Chinese media focusing on semiconductor news that Russia will soon...
Monday 27 May 2024
South Korea looks to bolster IC design sector, currently 1% of global market
South Korea has unveiled a support package to strengthen its semiconductor industry and catch up with international rivals. The plan aims to support large companies and weaker sectors,...
Monday 27 May 2024
Taiwan fab tool makers see demands rising in US and Europe
Onshoring efforts of semiconductor manufacturers have spurred the demand for more cost-effective fab tools. Fab machinery makers in Taiwan, including the supply chain partners of...
Monday 27 May 2024
Equipment maker Acter steps up investment in Southeast Asia
Cleanroom and turnkey equipment provider Acter has enjoyed a ramp-up in orders from Southeast Asia, where the Taiwan-based firm is stepping up its deployment and investment, said...
Thursday 23 May 2024
EIH dictates e-paper pricing, to focus on penetration rate
E Ink Holdings, a major e-paper manufacturer, is nearing the end of its inventory clearance phase. Chairman Johnson Lee stated that the inventory of modules is expected to be nearly...
Wednesday 22 May 2024
Csun contributes to advanced packaging supply chain, says company president
PCB and semiconductor equipment specialist Csun Manufacturing plays an important role in the supply chain for advanced 2.5D and 3D IC packaging, said company president Frank Liang...