AblePrint Technology (APT), a supplier of pneumatic and thermal process solutions for semiconductor packaging, has reported significant sales growth in 2024, driven by strong demand...
As the spring begins for 2025, China's IC industry has seen a major injection of funding. Wuxi SJ Semiconductor has closed a financing agreement worth roughly US$700 million. This...
The global political and economic landscape is characterized by volatility; nevertheless, sources within the semiconductor industry suggest that TSMC's expansion strategy for advanced...
US President Donald Trump's new policies have reignited the global trade war, leading to significant fluctuations in international precious metal prices, with gold reaching an all-time...
Despite the US's new tariff policy and other macroeconomic circumstances, TSMC is on track to boost its 2nm and advanced packaging fab capabilities in 2025, according to industry...
According to a report by Nikkei, Tongfu Microelectronics is rumored to have commenced trial production of high bandwidth memory (HBM2). This development follows fellow Chinese...
Recent US Section 301 tariffs targeting China's semiconductor industry have spotlighted the mature process segment. While the definition of mature processes remains somewhat fluid,...
Chinese foundries, despite their advanced process expertise and competitive pricing, remain less attractive to Taiwan-based IC design firms primarily due to intellectual property...
With customers advancing their orders in anticipation of President Trump's upcoming trade policies, Greatek Electronics, a Powertech Technology (PTI) Group company specializing in...
Backend house Powertech Technology (PTI) anticipates a resurgence in demand from the memory sector beginning in the second quarter, with further enhancement projected through the...
Kaynes SemiCon, a fully owned subsidiary of Kaynes Technology India, has emphasized the value of legacy semiconductor packages in driving the country's manufacturing goals.
Poland's aspirations to become a European AI leader have hit a significant roadblock following new US export controls on advanced technology. According to the Polish Press Agency...
GlobalFoundries has unveiled plans to invest US$575 million in a cutting-edge advanced packaging and photonics center at its Malta, New York, facility. This ambitious project is designed...
The US Department of Commerce announced on January 16, 2025, that the CHIPS Program's National Advanced Packaging Manufacturing Program (NAPMP) has finalized US$1.4 billion in awards...
TSMC CEO C.C. Wei has dismissed recent market speculation indicating Nvidia is cutting back its demand for Chip-on-Wafer-on-Substrate (CoWoS) packaging capacity.
