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NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
Friday 7 June 2024
ProAsia boosts mass production of SiC with 3Q24 first batch delivery
ProAsia Semiconductor, a subsidiary of Taiwan-Asia Semiconductor, has been investing in the research and development of third-generation Silicon Carbide (SiC) semiconductors.
Friday 7 June 2024
Chinese government gaining control of domestic semiconductor industry
China's state-owned capital has been fast expanding its investment in the country's semiconductor industry, taking control of major firms, according to industry sources.
Thursday 6 June 2024
WSTS raises global semiconductor market forecast for 2024 to 16% growth
The most recent forecast from World Semiconductor Trade Statistics (WSTS) indicates that the global semiconductor market is poised to enjoy robust growth in 2024 and 2025. WSTS also...
Wednesday 5 June 2024
Semiconductor foundry utilization rates seen higher than 80% in 2H24, thanks to AI boom
Driven by the Artificial Intelligence (AI) fervor, semiconductor foundry utilization rates are recovering worldwide. Industry sources in South Korea say that the average global semiconductor...
Wednesday 5 June 2024
How Taiwan is related to Nvidia's rise to stardom in the AI Era

Nvidia, founded in 1993, has established itself as a leading player in the Graphics Processing Unit (GPU) market.

Wednesday 5 June 2024
PCB makers optimistic about 2H24, as AI PCs showcase prominence of Taiwan-based supply chain
Computex has once again highlighted the contributions of the notebook and PC supply chain, with many PCB companies turning their efforts to AI PCs and servers this year.
Tuesday 4 June 2024
AMD adopts open strategy for networking infrastructure innovations
Besides presenting the CPU, NPU, and GPU architectures and products with strategic partners, AMD CEO Lisa Su also unveiled the company's ambitious plans for 2025 and beyond in her...
Tuesday 4 June 2024
Taiwan PCB makers see Intel's glass substrate too early for mass production
Intel has announced the industry's first Glass Core Substrate (GCS) technology for next-generation advanced packaging, which has once again attracted market discussion due to the...
Tuesday 4 June 2024
ABF substrate shortage unlikely to resume until 1Q26, says Unimicron
The market for ABF substrates is unlikely to see shortages return until the first quarter of 2026, according to T. J. Tseng, chairman of Unimicron Technology.
Tuesday 4 June 2024
Chinese chipmakers step up SiC production expansion
Chinese foundries including United Nova Technology and Silan, along with substrate suppliers, such as SICC, have all increased their Silicon Carbide (SiC) production capacity.
Monday 3 June 2024
SPIL invests US$1.276 billion to build facility in Penang, Malaysia
Semiconductor packaging and testing company Siliconware Precision Industry Ltd. (SPIL) announced recently that it will invest MLR 6 billion (US$1.276 billion) to build a packaging...
Monday 3 June 2024
Why China needs US$47.5 billion for Big Fund Phase 3 when chip oversupply is already a concern?
Announcing a US$47.5 billion funding for Phase 3 of the National IC Industry Investment Fund (the "Big Fund"), China's next move is under the eye of global chip players.
Monday 3 June 2024
PCB maker Unimicron expects to benefit from 5G AI, and HPC in 2H24
Leading Taiwanese PCB manufacturer Unimicron held its shareholders' meeting.
Friday 31 May 2024
Yageo chairman: inventory adjustments have reached healthy level
The passive component giant Yageo held its shareholders' meeting on May 30. Founder and chairman Pierre Chen stated that current inventory adjustments have reached a healthy level...
Friday 31 May 2024
WPG chairman shares insights into M&A and industrial holding strategies
Merger and acquisition (M&A) transactions in Taiwan grew 12% year-on-year in 2023 to 131 cases and may continue hitting another new high in 2024. Simon Huang, chairman of WPG...