Computex has once again highlighted the contributions of the notebook and PC supply chain, with many PCB companies turning their efforts to AI PCs and servers this year.
Besides presenting the CPU, NPU, and GPU architectures and products with strategic partners, AMD CEO Lisa Su also unveiled the company's ambitious plans for 2025 and beyond in her...
Intel has announced the industry's first Glass Core Substrate (GCS) technology for next-generation advanced packaging, which has once again attracted market discussion due to the...
The market for ABF substrates is unlikely to see shortages return until the first quarter of 2026, according to T. J. Tseng, chairman of Unimicron Technology.
Chinese foundries including United Nova Technology and Silan, along with substrate suppliers, such as SICC, have all increased their Silicon Carbide (SiC) production capacity.
Semiconductor packaging and testing company Siliconware Precision Industry Ltd. (SPIL) announced recently that it will invest MLR 6 billion (US$1.276 billion) to build a packaging...
Announcing a US$47.5 billion funding for Phase 3 of the National IC Industry Investment Fund (the "Big Fund"), China's next move is under the eye of global chip players.
The passive component giant Yageo held its shareholders' meeting on May 30. Founder and chairman Pierre Chen stated that current inventory adjustments have reached a healthy level...
Merger and acquisition (M&A) transactions in Taiwan grew 12% year-on-year in 2023 to 131 cases and may continue hitting another new high in 2024. Simon Huang, chairman of WPG...
Photomask company Taiwan Mask Corporation (TMC) has acquired four seats on optical component manufacturer TrueLight's board, during the latter company's board of directors election...
Charles Shen, Chairperson of Zhen Ding, the major PCB company, stated that the first half of 2024, as in previous years, is the off-season for operations. However, compared to the...
