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    Yesiang posts record revenue for third straight month on advanced process demand
    3min ago
    Weak China auto demand sends parts maker Hiroca deeper into North America, Japan
    5min ago
    China silicon wafer makers expand 12-inch capacity and consolidate mature-node operations
    Aug 10, 17:26
    Cambricon and Moore Threads post strong 1H26 growth as China AI chips move to deployment
    Aug 10, 17:26
    Google readies Pixel 11 lineup, market breakthrough still under question
    Aug 10, 17:26
    Interview: Nvidia says networking is the core of AI computing as AI factories scale
    Aug 10, 17:25
    Taiwan producer prices surge as non-China supply chains face rising pressure
    Aug 10, 17:25
    NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
    Monday 8 June 2026
    CWTC's May revenue hits record high as new plant targets late 2026 launch
    Lead frame manufacturer Chang Wah Technology Co. (CWTC) says that as applications such as data centers, AI servers, and industrial control systems continue to grow rapidly, market...
    Sunday 7 June 2026
    BOE says glass-based packaging substrate pilot line has yet to reach mass-production yield

    BOE Technology Group's push into glass-based packaging substrates remains short of mass production, even as the Chinese display maker...

    Friday 5 June 2026
    AI servers and MLCC recovery drive growth at Ample Electronic
    As artificial intelligence fuels demand across the electronics supply chain, Taiwanese conductive paste supplier Ample Electronic is seeing a rebound in one of the industry's most...
    Friday 5 June 2026
    AI demand strains PCB supply chains, lead times stretch past 20 weeks
    Explosive demand for artificial intelligence is widening supply chain bottlenecks for global electronics makers, with shortages now reaching from advanced chips and packaging into...
    Friday 5 June 2026
    US targets China's PCB grip as AI and defense supply risks mount
    As demand for artificial intelligence (AI) computing expands rapidly, market attention has long centered on GPUs, high-bandwidth memory (HBM), and advanced packaging. However, printed...
    Friday 5 June 2026
    India faces PCB supply squeeze as raw material shocks, AI demand, and import dependence drive costs higher
    India's PCB industry is facing mounting supply constraints and cost pressures, driven by a combination of raw material inflation, logistics disruptions, and a structural reliance on...
    Friday 5 June 2026
    Arm says Taiwan powers its rise as agentic AI lifts PC growth
    Arm CEO Rene Haas told the COMPUTEX keynote on June 2 that Taiwan has been inseparable from Arm's growth over the past 30 years, while Nvidia CEO Jensen Huang said that agentic AI...
    Friday 5 June 2026
    Hiwin targets logistics automation with Dexterity dual-arm robot
    Motion control component maker Hiwin made its first cross-sector appearance at COMPUTEX 2026, showcasing a full technology stack spanning precision transmission, actuator modules,...
    Friday 5 June 2026
    Hanmi Semiconductor eyes record sales in Computex debut as HBM4 demand grows
    Hanmi Semiconductor is projecting record annual revenue this year, as rising demand for high-bandwidth memory equipment lifts prospects for the South Korean chip-equipment maker and...
    Thursday 4 June 2026
    Ventec wins spillover high-speed CCL orders, revenue rises
    Ventec International said May 2026 revenue kept growing, driven by sustained demand for high-margin aerospace polyimide (PI) materials, the start of mass production after high-speed...
    Thursday 4 June 2026
    Samsung's rumored CIS production shift highlights industry debate over fab ownership
    Samsung Electronics' decision to place a key image sensor production line under its System LSI division highlights a broader question facing the CMOS image sensor (CIS) industry: whether...
    Thursday 4 June 2026
    LG Innotek targets Intel EMIB substrate chain with SK Hynix samples

    LG Innotek is seeking to enter the supply chain for substrates used in Intel's EMIB advanced-packaging technology, supplying early samples...

    Thursday 4 June 2026
    Taiwan test interface maker CHPT rides AI chip orders to record May revenue
    Chunghwa Precision Test Tech. (CHPT), a supplier of semiconductor test interfaces, reported revenue in May 2026 that reached another monthly record, supported by sustained orders from...
    Thursday 4 June 2026
    AI sparks tight supply warning for high-end passive components; MLCC rally eyes new super cycle
    AI-driven demand for computing infrastructure has ended the passive components industry's inventory adjustment phase, with Taiwan-based leaders Yageo and Walsin Technology both seeing...
    Thursday 4 June 2026
    Huawei's Tau Law shifts AI chip race to glass substrates, advanced packaging
    Huawei's recently proposed "Tau Law" suggests that reducing signal transmission distance, combined with heterogeneous integration and system-level optimisation, can enhance computing...
    17/62 pages
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    BIZ FOCUS
    Jul 30, 08:00
    EDOM Accelerates Edge AI Deployment with NVIDIA Technologies
    Monday 1 June 2026
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Thursday 30 July 2026
    ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging
    Wednesday 29 July 2026
    Arrow Drives System-Level Design, Turning Complexity into Competitive Advantage
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