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    UK semiconductor sector seeks to bridge AI-era commercialization gap
    35min ago
    Panel makers target semiconductor growth, with 2028 as a key test
    35min ago
    SDC, BOE consider HD OLED panels for entry-level smartphones
    35min ago
    Intel China targets green computing, plans computing pods for 1H27 deployment
    36min ago
    Samsung and Apple target locally thinned glass for 2028 foldables
    36min ago
    NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
    Friday 11 September 2026
    CIOE 2026: Hitachi relies on partnerships, not proprietary tech, to ride China's optical boom

    At an optoelectronics trade expo in China, Hitachi High-Tech used its booth not to unveil a flagship product of its own, but to showcase...

    Friday 11 September 2026
    AI packaging turns to glass, with TGV metallisation persisting as key technical hurdle
    Taiwan supply-chain sources said low-CTE glass fibre cloth used in high-end substrates remains tight, while glass-core substrates for next-generation packaging are still in technical...
    Friday 11 September 2026
    AI server tracker: Taiwan's August filings say demand is still accelerating
    The clearest read yet on whether the AI build-out is still accelerating arrived this week in a batch of unaudited Taipei filings, and it accelerated. The 49 Taiwan-listed companies...
    Friday 11 September 2026
    Global IC substrate market to surge 32% to US$19.5 billion in 2026 as Taiwan, Korea lead ABF, BT
    Rising demand for generative AI, high-performance computing (HPC), and data center buildouts is pushing the global IC substrate industry into a new phase marked by upgrades in high-end...
    Thursday 10 September 2026
    AUO matching glass substrate size stokes TSMC collab speculation
    AUO is accelerating its transformation by extending its established large-format panel manufacturing capabilities into advanced semiconductor packaging.
    Thursday 10 September 2026
    Spirox TGV inspection capable of scanning entire substrate in 20 minutes
    As advanced packaging moves toward higher-density stacking, demand is rising for glass through-glass via (TGV) and through-silicon via (TSV) inspection, while glass core substrates...
    Thursday 10 September 2026
    China gets an early shot at the next SiC power-chip cycle

    Alkaidsemi (Shanghai) Technologies Corporation has introduced a 1,200 V silicon carbide superjunction MOSFET that it describes as the...

    Thursday 10 September 2026
    Samsung Electro-Mechanics' glass-substrate rollout slows as TSMC evaluation drags on

    Samsung Electro-Mechanics (Semco) is facing a slower glass-substrate rollout as a reliability evaluation of through-glass via (TGV) modules...

    Thursday 10 September 2026
    Nvidia reportedly drives testing interface capacity crunch, pushes Taiwan suppliers
    AI chip demand is tightening high-end testing interface capacity, and supply-chain sources say Nvidia has raised prices to secure most of the probe card and test socket output from...
    Thursday 10 September 2026
    Europe and US IDM grid-to-core push challenges Taiwan power modules
    Data-center power systems are entering a new phase as operators move toward 800V HVDC and denser DC-DC architectures, raising demand for high-voltage, low-loss, and high-frequency...
    Thursday 10 September 2026
    Yageo's August revenue hits record on AI demand
    Yageo posted year-over-year and month-over-month revenue growth in August, extending its streak of record monthly highs to a sixth straight month. The passive components maker said...
    Thursday 10 September 2026
    AI server ODMs face widening component mismatches, with shortages reaching 15–20%
    Nvidia's Vera Rubin platform is entering its production ramp, and although server ODM shipments are still expected to ramp further, server ODMs delivered strong operating results in...
    Thursday 10 September 2026
    Silicon photonics boom could push InP supply-demand gap above 70%, triggering race for strategic optical resources
    As AI drives the transition toward high-speed transmission technologies such as 800G and 1.6T, silicon photonics has become increasingly mainstream in high-speed optical communications,...
    Wednesday 9 September 2026
    Ample Electronic hits 120% utilization as MLCC customers step up copper paste orders
    Ample Electronic Technology said strong demand for passive components and artificial intelligence (AI) server-related products is boosting business momentum, as multi-layer ceramic...
    Wednesday 9 September 2026
    LG Innotek tackles glass substrate microcrack issue as 2028 production race heats up

    LG Innotek is applying internally developed artificial intelligence to semiconductor glass substrate manufacturing, targeting microcracks,...

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    BIZ FOCUS
    Nov 5, 08:00
    Can Wearable Health Devices Reflect Traditional Chinese Medicine Concepts?
    Tuesday 3 November 2026
    NVIDIA CEO and Sweden's Technology Leaders Discuss Compute's Next Chapter
    Friday 30 October 2026
    Macronix to Showcase Automotive and IoT Memory Solutions at electronica 2026
    Thursday 29 October 2026
    STMicroelectronics to propose the reappointment of Jean-Marc Chery as President & CEO