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    NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
    Tuesday 25 August 2026
    AI's power crunch hits Taiwan: foundry capacity tightens, chip prices climb into 2H26
    AI data centres are becoming a new stress point for the global power and semiconductor supply chain. As facilities shift towards megawatt-scale architectures, demand is rising for...
    Tuesday 25 August 2026
    OmniVision's CIS business slips, but machine vision and robotics surge 71%
    OmniVision Group reported a sharp drop in first-half 2026 profit as weakness in consumer electronics and automotive electronics weighed on its core image sensor business, even as machine...
    Tuesday 25 August 2026
    Commentary: Nvidia's 15% hike piles pressure on the AI supply chain, lifts ASIC prospects
    Nvidia has reportedly notified major customers that server systems using its AI chips will rise by more than 15%, with the new pricing set to apply to models shipping from early 2027,...
    Monday 24 August 2026
    TPK TGV pilot line to start by September, Thailand plant eyes 2027 ramp
    TPK Holding is accelerating its move from consumer touch panels into semiconductors, with its Through Glass Via (TGV) pilot line in Taoyuan, Taiwan set to begin operations in August...
    Monday 24 August 2026
    AI chip boom lifts South Korean semiconductor materials makers' profits in 2Q26
    The AI semiconductor investment boom is increasingly spilling over into the materials supply chain. South Korea's major semiconductor materials suppliers broadly improved profitability...
    Monday 24 August 2026
    CPO hurdles linger as 800G and 1.6T SiPh surge, says analyst
    Challenges around co-packaged optics (CPO) remain unresolved, but they have not slowed the rapid rise of 800G and 1.6T silicon photonics, DIGITIMES analyst Kiwi Hsu said on August...
    Saturday 22 August 2026
    Manz Asia says yield is key to glass core mass production
    As AI chips continue to grow in size, the shift in advanced packaging from 300 mm wafers to square panels is becoming clearer, driving parallel development of new packaging technologies...
    Friday 21 August 2026
    China silicon wafer maker NSIG nears 1.2 million monthly 300mm capacity after 90% shipment jump
    National Silicon Industry Group (NSIG) reported a 36.51% rise in first-half 2026 revenue as shipments of 300mm semiconductor silicon wafers increased more than 90%, though continued...
    Thursday 20 August 2026
    China reportedly delays germanium, quartz clearances, impacting Taiwan optics and aerospace suppliers
    China has reportedly delayed customs clearance for critical materials — including germanium, quartz-based materials and neodymium magnets — since 2025, lengthening delivery...
    Thursday 20 August 2026
    Chinese SiC substrate maker SICC hits record Q2; 8-inch wafers top 50% of core revenue

    SICC reported stronger first-half 2026 revenue and margins as its 8-inch silicon carbide substrate business gained scale, highlighting...

    Thursday 20 August 2026
    Asia Optical eyes Metalens, CPO, and AI cooling opportunities; digital camera shipments to surpass 4 million units
    Asia Optical delivered strong second-quarter financial results while accelerating its strategic expansion across optical technologies. Key growth drivers include Metalens and Co-Packaged...
    Thursday 20 August 2026
    High-end PCB supply tightens as CCL expansions face delays
    As AI applications demand faster data transmission from PCBs, M8 and higher-grade copper-clad laminate (CCL) materials are becoming increasingly mainstream in server boards. The shift...
    Wednesday 19 August 2026
    Manz Asia targets PLP demand with three lines and three sizes
    Manz Asia is broadening its push into panel-level packaging (PLP) as interest in the technology continues to rise. General manager Robert Lin said the company has shipped more than...
    Wednesday 19 August 2026
    PLP splits roles as FOPLP focuses on cost and CoPoS courts AI chips
    As AI chips move toward larger dies and higher integration, advanced packaging is shifting from 300mm wafers to square panel manufacturing. In panel-level packaging (PLP), FOPLP and...
    Wednesday 19 August 2026
    Taiwanese firms' China investment returns hit record high on AI boom

    Driven by surging global demand for AI and high-performance computing (HPC), Taiwanese listed companies achieved record combined profits...

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    BIZ FOCUS
    Oct 23, 08:00
    AI Wealth Management: MaiCoin Leverages Startup Energy for Next-Gen Fintech
    Thursday 22 October 2026
    HOYA BIT Explores AI Data Analysis Solutions for Smarter Trading
    Wednesday 21 October 2026
    Starting with Data Challenges: TS Holdings Explores AI Through Hackathon
    Tuesday 20 October 2026
    Cincoze's EMC Solution Boosts Equipment Stability and Production Efficiency