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NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
Monday 25 May 2026
Embedded substrates draw AI chip interest as packaging turns strategic
Rising interest in embedded substrates among Nvidia, AMD, and Intel signals potential shifts in AI data‑center supply chains, as the technology promises improved signal integrity...
Sunday 24 May 2026
Geopolitics disrupts chips — can Taiwan and South Korea cooperate to hold the line?
The global semiconductor industry is being pulled in two directions. On one side, the cost of building a single advanced chip factory has ballooned to as much as US$40 billion, concentrating...
Sunday 24 May 2026
AI server boom squeezes Samsung Electro-Mechanics' component supply

Samsung Electro-Mechanics is emerging as another beneficiary of the AI data center buildout, as demand for high-end capacitors and package...

Saturday 23 May 2026
Taiwan power chip maker Panjit targets AI and robotics for next growth phase

Panjit International Inc. is accelerating its expansion into AI and automotive electronics as the Taiwanese power semiconductor maker positions...

Friday 22 May 2026
WPG Holdings flags server supply gaps amid memory price hikes, 800V shift
Amid the continued crowding-out effect of artificial intelligence (AI) demand, IC distributor WPG Holdings said memory shortages and rising prices are weakening end-product sales momentum,...
Friday 22 May 2026
AP Memory IPD enters Intel's EMIB supply chain, shipments set for 2Q26
Specialty memory design company AP Memory is positioning itself to capture growth momentum from stack silicon capacitors (S-SiCap). The company said its discrete S-SiCap products,...
Friday 22 May 2026
TSMC supply chain material maker AMC rides AI packaging yield boom

Alliance Material Co. (AMC), a Taiwan-based advanced semiconductor materials supplier, said its balance film anti-warpage material has...

Friday 22 May 2026
BOE, Corning target glass substrates for AI chip packaging

BOE Technology, China's leading display panel maker, is expanding its push into new businesses beyond panels. The company said on the...

Thursday 21 May 2026
AI chip boom strains ABF substrate supply chain
AI is shifting the semiconductor supply chain's next bottleneck from wafer fabrication and HBM memory to ABF substrates — a lower-profile but critical packaging material used...
Thursday 21 May 2026
LG Innotek wins long-term substrate deals as Intel and cloud giants secure supply
LG Innotek has secured substrate supply terms with major technology customers that increasingly resemble long-term agreements used in the memory-chip sector, boosting the South Korean...
Thursday 21 May 2026
OSE targets AI server SMT growth as memory demand lifts outlook
Orient Semiconductor Electronics (OSE) said that strong memory market demand is lifting its outlook and expanding its role in the memory supply chain, while also strengthening its...
Thursday 21 May 2026
AI server demand tightens passive component supply, lifting Taiwanese suppliers' share
Demand for artificial intelligence servers and related power systems is pushing lead times higher for high-end multilayer ceramic capacitors, elongated electrolytic capacitors, and...
Thursday 21 May 2026
TSMC's COUPE push puts Samsung's silicon photonics ambitions under pressure
Samsung Electronics has launched silicon photonics foundry services and entered pilot production, signaling during its latest earnings call that optical communication modules will...
Wednesday 20 May 2026
ASML to deliver first High-NA chips within months despite cost concerns
ASML expects its first advanced semiconductors made using next-generation High-Numerical Aperture (High-NA) extreme ultraviolet (EUV) lithography equipment to ship within months.
Wednesday 20 May 2026
China's OSATs chase bigger role as AI chips strain packaging supply

China's OSAT providers are trying to move deeper into advanced packaging as artificial intelligence (AI) demand strains global chip packaging...