Siliconware Precision Industries (SPIL) has moved to expand production capacity at a fast pace for high-end IC packaging and testing in anticipation of robust demand for mobile communication...
Demand for high-end IC packaging and testing is expected to pick up in the second half of 2013 and enjoy sequential growth through the last quarter of the year, thanks to a pull-in...
Sales of Advanced Semiconductor Engineering's (ASE) core ATM (assembly test and material) business increased 6.3% sequentially and 12.2% from a year ago to NT$12.41 billion (US$419...
IC backend service company Siliconware Precision Industries (SPIL) has decided to hike its capex budget for 2013 to NT$14.9 billion (US$496.14 million), up nearly 32% from NT$11.3...
Supply for high-end IC packaging is likely to fall short of demand during the second half of 2013, according to Bough Lin, chairman for Siliconware Precision Industries (SPIL). SPIL...
Market watchers are more optimistic about the IC packaging and testing business in the second quarter of 2013, judging from a rosy outlook provided by TSMC for the quarter. Sales...
IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) both saw their monthly revenues rebound to a sequential growth track in March 2013...
Taiwan-based IC packaging and testing service provider Siliconware Precision Industries (SPIL) will distribute a cash dividend per share of NT$1.67 for 2012.
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) both have reported decreased sales for February, but their sales are expected to gain momentum...
Altera and Xilinx both have decided to adopt PoP (package on package) packaging technology for its next-generation chips, instead of using chip-on-wafer-on-substrate (CoWoS) process...
Production value of Taiwan's dedicated semiconductor packaging and testing industry is forecast to grow 4.9% to US$13.88 billion in 2013, while the global industry will generate a...
Buoyed by its recent acquisition of a chemical material supplier, as well as brisk demand from IC foundries, Grand Plastic Technology (GPTC) has reported significant on-year growth...
The available capacity for 28nm mobile chips at IC foundries, mainly Taiwan Semiconductor Manufacturing Company (TSMC), has become sufficient to meet demand since early 2013. Suppliers...
IC packaging and testing companies will suffer setbacks in revenues during January and February because of inventory adjustments at clients, as well as fewer working days due to the...
