Siliconware Precision Industries (SPIL) chairman Bough Lin has expressed optimism that demand for communications ICs will be strong in the second half of 2013 on the back of brisk...
Disappointing sales of higher-end smartphones might have a negative impact on Siliconware Precision Industries' (SPIL) sales performance during the second half of 2013, according...
IC demand for mobile devices particularly smartphones is expected to drive revenue growth at packaging and testing houses Siliconware Precision Industries (SPIL) and King Yuan Electronics...
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) are expected to see their sales for the third quarter of 2013 affected by reduced orders from...
Siliconware Precision Industries (SPIL) has moved to expand production capacity at a fast pace for high-end IC packaging and testing in anticipation of robust demand for mobile communication...
Demand for high-end IC packaging and testing is expected to pick up in the second half of 2013 and enjoy sequential growth through the last quarter of the year, thanks to a pull-in...
Sales of Advanced Semiconductor Engineering's (ASE) core ATM (assembly test and material) business increased 6.3% sequentially and 12.2% from a year ago to NT$12.41 billion (US$419...
IC backend service company Siliconware Precision Industries (SPIL) has decided to hike its capex budget for 2013 to NT$14.9 billion (US$496.14 million), up nearly 32% from NT$11.3...
Supply for high-end IC packaging is likely to fall short of demand during the second half of 2013, according to Bough Lin, chairman for Siliconware Precision Industries (SPIL). SPIL...
Market watchers are more optimistic about the IC packaging and testing business in the second quarter of 2013, judging from a rosy outlook provided by TSMC for the quarter. Sales...
IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) both saw their monthly revenues rebound to a sequential growth track in March 2013...
Taiwan-based IC packaging and testing service provider Siliconware Precision Industries (SPIL) will distribute a cash dividend per share of NT$1.67 for 2012.
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) both have reported decreased sales for February, but their sales are expected to gain momentum...
Altera and Xilinx both have decided to adopt PoP (package on package) packaging technology for its next-generation chips, instead of using chip-on-wafer-on-substrate (CoWoS) process...
