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NEWS TAGGED SPIL
Thursday 21 June 2012
ASE, SPIL gearing up for capacity expansion
IC packaging and testing firms Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have both reiterated their commitment to expand capacity in 2012...
Wednesday 20 June 2012
SPIL steps up capacity expansion
IC packager Siliconware Precision Industries (SPIL) is stepping up capacity expansion efforts in 2012 with planned capital expenditure of a record NT$17.5 billion, chairman Bough...
Monday 11 June 2012
Major Taiwan IC backend firms to post over 5% sales growth in 2Q12
Major Taiwan-based IC packaging and testing houses including Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL), Powertech Technology (PTI) and Chipbond...
Thursday 7 June 2012
ASE, SPIL post sales growth in May
IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) both saw their May revenues register single-digit growth.
Monday 4 June 2012
IC packagers reiterate sales guidance for 2Q12, says report
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have reiterated their previous guidances for the second quarter of 2012, according to a Chinese-language...
Monday 28 May 2012
SPIL to expand packaging, testing capacity at China subsidiary
Siliconware Precision Industries (SPIL), a Taiwan-based provider of IC packaging/testing service, will add investment of US$100 million in Siliconware Technology (Suzhou) to expand...
Tuesday 8 May 2012
ASE, SPIL post slight drops in April sales
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have reported slight decreases in consolidated revenues for April 2012. ASE announced consolidated...
Thursday 26 April 2012
SPIL sees sales growth in 2Q12 with higher gross margins
Siliconware Precision Industries (SPIL), the world's third largest IC packaging and testing services provider, expects to post sales growth of 7-11% sequentially in the second quarter...
Wednesday 11 April 2012
Chipbond, ChipMOS see sequential growth in March revenues
LCD driver IC packaging and testing service providers Chipbond Technology reported March revenues of NT$1.172 billion (US$39.7 million), an increase of 7.8% on month. The firm reported...
Tuesday 10 April 2012
ASE 1Q12 sales slip
Consolidated revenues at Advanced Semiconductor Engineering (ASE) registered declines of 7.1% sequentially and 6.3% on year in the first quarter of 2012. Sales of its core IC assembly...
Friday 6 April 2012
SPIL March sales up 18%
Consolidated revenues at Siliconware Precision Industries (SPIL) grew 18% on month to NT$5.54 billion (US$188 million) in March 2012 bringing its year-to-date sales to NT$14.08 billion...
Tuesday 3 April 2012
ASE, SPIL report slight decreases in 2011 revenues
IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) reported 2011 consolidated revenues that represented an on-year decrease of 1.8%...
Tuesday 20 March 2012
ASE, SPIL remain conservative on business outlook
While the recent news that Taiwan Semiconductor Manufacturing Company (TSMC) is mulling an upward revision in 2012 capex has boosted market observers' confidence in the outlook for...
Friday 9 March 2012
ASE February sales up, SPIL down
Advanced Semiconductor Engineering (ASE) saw sales of its core IC ATM (assembly test and material) business grow 3.9% on month to NT$9.49 billion (US$320 million) in February 2012...
Thursday 1 March 2012
March shipments of 4G mobile phones to reach over 1 million
Mobile phone makers Samsung and HTC both target 4G phone shipments in March to exceed one million units. Shipments in second-quarter 2012 are likely to reach 5-10 million units. Suppliers...