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NEWS TAGGED SPIL
Thursday 23 June 2011
SPIL turning focus to SiP packaging, IDM orders
Siliconware Precision Industries (SPIL) is stepping up the development of system-in-package (SiP) specifically for use in handsets, and has been more actively expanding its IDM client...
Wednesday 8 June 2011
IC packagers post slight growth in May revenues
Advanced Semiconductor Engineering (ASE) has announced that sales of its ATM (assembly test and material) division grew 1.8% sequentially to NT$10.95 billion (US$382 million) in May...
Friday 3 June 2011
Copper pillar to be mainstream FC packaging technology in 2012
IC packagers Advanced Semiconductor Engineering (ASE), Amkor Technology, Siliconware Precision Industries (SPIL) and STATS ChipPAC have all started developing a new flip-chip (FC)...
Monday 9 May 2011
ASE, SPIL April sales down slightly on-month
Chip packaging and testing firms Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL) have reported sequential drops of 2.5% and 5.1%, respectively, in...
Thursday 28 April 2011
Normal substrate supply to resume in June, says SPIL chairman
Siliconware Precision Industries (SPIL) chairman Bough Lin on April 27 confirmed that the company has been facing stretched lead times for its IC substrates due to limited availability...
Thursday 14 April 2011
IC backend 2Q11 sales likely affected by material shortages
IC packaging and testing firms including Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) are expected to provide a cautious outlook for the second...
Friday 8 April 2011
ASE core ATM unit posts 5% sales drop in 1Q11; SPIL also down
Advanced Semiconductor Engineering (ASE) has announced that sales of its ATM (assembly test and material) division slid 5.3% sequentially to NT$30.88 billion (US$1.07 billion) in...
Thursday 31 March 2011
ASE to deal out dividend of NT$1.80 for 2010
Advanced Semiconductor Engineering (ASE) will deal out a dividend of NT$1.80 (US$0.06), including NT$1.15 in stocks and NT$0.65 in cash, for 2010, according to a decision made by...
Friday 25 March 2011
TSMC leads supplier partners to complete first IC supply chain carbon footprint verification for Taiwan
Taiwan Semiconductor Manufacturing Company (TSMC) has announced that it led 15 supplier partners in jointly completing Taiwan's first semiconductor supply chain carbon footprint verification...
Wednesday 9 March 2011
ASE February sales down 11% sequentially
Advanced Semiconductor Engineering (ASE) has announced consolidated revenues of NT$13.87 billion (US$471.5 million) for February 2011, down 11.1% sequentially. However, February sales...
Tuesday 8 March 2011
Taiwan packaging and testing firms post sequential drops in February
All major Taiwan-based chip packaging and testing firms saw sequential declines in consolidated sales in February 2011.
Friday 4 March 2011
SPIL sees boost in copper wirebonding orders, says paper
With more fabless IC firms adopting copper wire to package their products for cost reasons, packaging and testing house Siliconware Precision Industries (SPIL) has seen a substantial...
Friday 11 February 2011
SPIL January sales down 5% on-month
IC packager Siliconware Precision Industries (SPIL) has announced consolidated revenues of NT$5.01 billion (US$172 million) for January 2011, down 5.6% on month. Sales also dropped...
Friday 28 January 2011
ASE 4Q10 net profits up 44%; full-year profits soar
Advanced Semiconductor Engineering (ASE) has announced net profits for the fourth quarter of 2010 climbed 43.8% on year to NT$4.96 billion (US$171 million). Net profits for the whole...
Thursday 27 January 2011
SPIL expects to outpace industry growth in 2011, says chairman
Siliconware Precision Industries (SPIL) expects its sales growth to outperform the industry average in 2011, company chairman Bough Lin said at an investors meeting on January 26.