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NEWS TAGGED SPIL
Thursday 27 January 2011
SPIL 4Q10 gross margin up on higher copper wire bonding sales
Siliconware Precision Industries (SPIL) saw its gross margin increase to reach 14.3% in the fourth quarter of 2010, up 0.1pp sequentially and beating market estimates. The chip packager...
Thursday 20 January 2011
Second-tier IC packagers lower quotes to woo orders from IC designers
Second-tier IC packaging and testing companies have lowered their quotes by 5-10% on average recently in order to attract more orders from IC design houses who have been switching...
Thursday 6 January 2011
SPIL 4Q10 sales down 5% on quarter
Chip packager Siliconware Precision Industries (SPIL) saw consolidated revenues total NT$15.48 billion (US$530 million) in the fourth quarter of 2010, down 5.1% sequentially and meeting...
Thursday 6 January 2011
SPIL reportedly seeking to buy KYEC shares from UMC
Industry rumors have circulated that Siliconware Precision Industries (SPIL) is in talks with United Microelectronics Corporation (UMC) about a takeover of UMC's holdings in testing...
Tuesday 4 January 2011
IC packagers see stronger-than-expected 1Q11
IC packaging and testing houses will see demand for the first quarter of 2011 stronger than the same period in previous years, when revenues were usually dragged down by 10-15% sequentially,...
Tuesday 7 December 2010
ASE, SPIL post mixed results for November
Advanced Semiconductor Engineering (ASE) saw net sales generated from its core ATM (assembly test and material) business slide 3.9% sequentially to NT$10.74 billion (US$356 million)...
Monday 29 November 2010
MediaTek reportedly negotiating new prices with UMC and backend service providers
MediaTek is reportedly negotiating with United Microelectronics Corporation (UMC) as well as backend service providers including Advanced Semiconductor Engineering (ASE) and Siliconware...
Wednesday 24 November 2010
ASE grabs copper wirebonding orders from second-tier players
With Silicon Precision Industries (SPIL) quickly catching up with Advanced Semiconductor Engineering (ASE) in copper wirebonding, ASE is currently attempting to win orders over second-tier...
Tuesday 9 November 2010
ASE, SPIL October revenues down on-month
Chip packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) both saw revenues decrease on month in October 2010, according to data released...
Thursday 28 October 2010
Packaging and testing sector to see 7-13% growth in 2011, says SPIL chairman
Siliconware Precision Industries (SPIL) chairman Bough Lin expects the packaging and testing sector to see a 7-13% rise in 2011, and the overall chip market to show stable growth.
Thursday 28 October 2010
SPIL 3Q10 profits down 42% on year, revenues slip
Chip packager Siliconware Precision Industries (SPIL) has announced net profits of NT$1.49 billion (US$48 million) for the third quarter of 2010, down 41.8% from a year earlier. Net...
Tuesday 12 October 2010
ASE and SPIL likely to see 1Q11 profits halve, says paper
Major chip packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) are likely to see their profits for the first quarter of 2011 halve from...
Thursday 7 October 2010
ASE core ATM business posts 7% growth in 3Q10 sales
Chip packager Advanced Semiconductor Engineering (ASE) saw sales of its ATM (assembly test and material) division grow 7.3% sequentially to NT$34.02 billion (US$1.1 billion) in the...
Wednesday 6 October 2010
SPIL 3Q10 sales miss market estimates
Taiwan-based chip packager Siliconware Precision Industries (SPIL) collected NT$5.22 billion (US$169 million) in consolidated revenues in September 2010, down 6.4% from August, according...
Monday 20 September 2010
ASE holds rosy outlook on 4Q10 business
Taiwan-based IC packaging/testing service provider Advanced Semiconductor Engineering (ASE) has seen better orders than originally expected due to strong demand for handsets and consumer...