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NEWS TAGGED SPIL
Monday 1 February 2010
SPIL stepping up pace of copper wirebonder purchases
Siliconware Precision Industries (SPIL), which falls behind Advanced Semiconductor Engineering (ASE) in copper-wire bonding processes, plans to add an additional 400-600 copper wire...
Thursday 28 January 2010
UMC teams up with three others to seek government funding for MEMS project
United Microelectronics Corporation (UMC) has teamed up with Integrated Technology Express (ITE), Siliconware Precision Industries (SPIL) and King Yuan Electronics (KYEC) to jointly...
Friday 8 January 2010
ASE and SPIL to see strong 1Q10
IC packaging and testing houses Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) are expected to see revenues drop less than 5% sequentially in...
Thursday 7 January 2010
Spansion to strengthen ties with Taiwan backend partners, says executive
Spansion intends to enhance cooperation with its Taiwan-based partners such as Powertech Technology (PTI) and Siliconware Precision Industries (SPIL) in 2010, according to John Nation,...
Thursday 31 December 2009
IC packaging and testing companies feeling relief after Tessera lost in lawsuit against DRAM makers
Taiwan-based IC packaging and testing companies, along with DRAM chip vendors, have felt a sense of relief after the US International Trade Commission (ITC) issued a final determination...
Wednesday 30 December 2009
Taiwan likely to lift cross-strait ban on backend semiconductor technology soon
The Taiwan government will likely lift a ban on local firms setting up more advanced packaging and testing operations in China in early 2010, according to market sources. The government...
Wednesday 23 December 2009
Amkor raises 4Q09 revenue guidance; Taiwan rivals expect growth
Amkor Technology has announced it expects revenues for the fourth quarter to grow by around 6% sequentially, attributing the better outlook to higher-than-expected customer demand...
Monday 7 December 2009
IC packaging and testing companies experiencing strong orders for December 09 and 1Q10
Most Taiwan-based chip packaging and testing houses have received stronger than expected orders for December 2009 as well as for the first quarter of 2010, expecting minimal seasonal...
Wednesday 25 November 2009
STATS ChipPAC moves copper wire bonding process to volume production
STATS ChipPAC has ramped production on its copper wire bonding process, joining rivals Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL).
Tuesday 17 November 2009
ASE, SPIL revenues expected to drop slightly in November
Chip packaging and testing house Advanced Semiconductor Engineering (ASE) is likely to see revenues slip by less than 5% on month in November 2009, while Siliconware Precision Industries...
Thursday 12 November 2009
SPIL to buy factory from PSC for NT$1.78 billion
Chip packaging and testing house Siliconware Precision Industries (SPIL) has announced it will spend NT$1.78 billion (US$54.94 million) buying a factory with production equipment...
Tuesday 10 November 2009
ASE and SPIL revenues hit 2-year high in October
IC packaging and testing house Advanced Semiconductor Engineering (ASE) saw revenues in October 2009 reach a two-year high at NT$4.9 billion (US$152 million), while rival Siliconware...
Monday 2 November 2009
ASE, SPIL speeding up copper wire bonding expansion
Advanced Semiconductor Engineering (ASE) plans to add an additional 2,000 copper wirebonders by the end of 2010, while Siliconware Precision Industries (SPIL) will add 200-300 copper...
Thursday 29 October 2009
SPIL says 2010 capex to double
Siliconware Precision Industries (SPIL) has set its capex budget for 2010 at NT$10 billion (US$307.7 million), doubling from NT$5.3 billion allocated for 2009, according to company...
Friday 16 October 2009
ASE and SPIL deny headhunting rumors
Taiwan-based chip packaging houses Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have both come out to deny a Citi Investment Research report...