Market watchers have revised upward their revenue growth estimates for Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), and expect the IC packaging...

Siliconware Precision Industries (SPIL) is expected to announce an upward revision of its projected capex for 2009 at its upcoming investors conference, according to industry sources...

IC packaging and testing firms Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) both saw revenues for September 2009 grow on year, ending a streak...

Advanced Semiconductor Engineering (ASE) has been ramping up its output utilizing a copper wire bonding process, with shipments of such ICs reaching over 50 million units in the past...

Siliconware Precision Industries (SPIL) and Orient Semiconductor Electronics (OSE) recently landed more outsourcing orders for packaging microSD card modules from Samsung Electronics,...

MediaTek plans to leap to 45nm processing for 3G chips in the first quarter of 2010 despite that volume production of 65nm WCDMA chips is scheduled to begin in the fourth quarter...

Advanced Semiconductor Engineering (ASE) has announced consolidated revenues of NT$8.35 billion (US$254 million) for August, with the on-year decline narrowing to negative 4.9%. Rival...

Logic IC and memory testing house King Yuan Electronics Company (KYEC) announced on August 20 that its board of directors has approved the investment in Taiwan Memory Company (TMC)...

Taiwan-based IC packaging and testing service providers are expected to post sequential revenue drops of less than 10% in the fourth quarter of 2009, but overall gross margins may...

Packaging and testing house Siliconware Precision Industries (SPIL) has announced its board of directors on August 13 approved plans to invest in Taiwan Memory Company (TMC), making...

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have reported sequential revenue increases from February through July 2009, with smaller on-year...

Advanced Semiconductor Engineering (ASE) plans to increase wire-bond and bumping capacity, and Siliconware Precision Industries (SPIL) will expand its flip-chip (FC) ball-grid array...

Amkor Technology is expected to see the strongest revenue growth among top packaging and testing houses in th third quarter, followed by Advanced Semiconductor Engineering (ASE),...

Following a better-than-expected second quarter financial report, IC packaging and testing firm Siliconware Precision...

IC packager Siliconware Precision Industries (SPIL) has announced revenues for second-quarter 2009 grew 53.6% sequentially to NT$14.14 billion (US$430 million), and margins for the...