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NEWS TAGGED SPIL
Monday 27 April 2009
ASE and SPIL 2Q09 revenues to grow over 30%
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) will likely enjoy revenue growth of more than 30% sequentially in the second quarter of 2009,...
Thursday 23 April 2009
IC packaging firms ASE and SPIL gain shifted orders
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have recently seen more orders shifted from Amkor Technology, STATS ChipPAC Taiwan Semiconductor...
Monday 13 April 2009
Integrated handheld solutions driving demand for wafer-level packaging, says ASE
Handheld devices incorporating functionality such as Bluetooth, FM radio, GPS and Wi-Fi have become the market driver for wafer-level packaging (WLP), Taiwan's Advanced Semiconductor...
Wednesday 8 April 2009
ASE 1Q09 revenues beat guidance
Packaging and testing house Advanced Semiconductor Engineering (ASE) has announced revenues of NT$5.5 billion (US$163 million) for March, up 28.2% on month. The company's first-quarter...
Monday 6 April 2009
Packaging firm SPIL revenues up 29% in March, likely to swing to profits in 1Q09
Siliconware Precision Industries (SPIL) has announced revenues of NT$3.87 billion (US$117 million) for March, an increase of 28.9% on month. However, its accumulated sales for the...
Friday 27 March 2009
ASE 1Q revenue drop expected to narrow from original forecast
With Amkor Technology recently revising up its gross margin outlook for the first quarter and indicating that its revenues will fall into the avorable end of the range of the company's...
Wednesday 25 March 2009
ASE, SPIL 2Q utilization to rebound
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) may see their packaging and testing utilization rates climb to 60% in the second quarter of 2009,...
Friday 20 March 2009
IC packaging and testing firms to see April growth
Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL) and King Yuan Electronics Company (KYEC) will see better-than-expected performances in April amid...
Wednesday 18 March 2009
Tessera terminates patent lawsuit against packaging and testing firms
Tessera Technologies has withdrawn a patent infringement lawsuit against Taiwan- and Singapore-based IC packaging and testing service providers, with industry soruces saying that...
Monday 9 March 2009
Most IC backend service suppliers see siginificant growth in February
Most packaging and testing houses, including Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industry (SPIL), saw significant increases in sales in February, thanks...
Thursday 5 March 2009
IC backend suppliers see utilization recovering on white-box handset demand
IC packaging houses Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), and testing specialists Sigurd Microelectronics and King Yuan Electronics...
Monday 23 February 2009
Taiwan dollar depreciation boosting ASE and SPIL sales amid rising gold costs
The depreciation of the Taiwan dollar is expected to more than offset the extra costs from rising gold prices for Taiwan's packaging and testing houses who have high proportions of...
Friday 13 February 2009
ASE 1Q09 revenues to slide up to 40%; capex slashed
Advanced Semiconductor Engineering (ASE) has estimated that its sales in the first quarter of 2009 may drop 35-40% sequentially amid a continuing dim outlook. The wafer packaging...
Thursday 12 February 2009
Taiwan IC packaging and testing production value to drop 35% in 1Q09, says SPIL chairman
Bough Lin, chairman of Siliconware Precision Industries (SPIL), has estimated that the production value of Taiwan's IC packaging and testing industry will drop 35% sequentially in...
Wednesday 11 February 2009
Packaging and testing house SPIL in the red in 4Q08
Siliconware Precision Industries (SPIL) has announced that its revenues for the fourth quarter of 2008 were NT$12.45 billion (US$366 million), which represented a 27.8% decrease from...
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