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NEWS TAGGED SPIL
Friday 27 March 2009
ASE 1Q revenue drop expected to narrow from original forecast
With Amkor Technology recently revising up its gross margin outlook for the first quarter and indicating that its revenues will fall into the avorable end of the range of the company's...
Wednesday 25 March 2009
ASE, SPIL 2Q utilization to rebound
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) may see their packaging and testing utilization rates climb to 60% in the second quarter of 2009,...
Friday 20 March 2009
IC packaging and testing firms to see April growth
Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL) and King Yuan Electronics Company (KYEC) will see better-than-expected performances in April amid...
Wednesday 18 March 2009
Tessera terminates patent lawsuit against packaging and testing firms
Tessera Technologies has withdrawn a patent infringement lawsuit against Taiwan- and Singapore-based IC packaging and testing service providers, with industry soruces saying that...
Monday 9 March 2009
Most IC backend service suppliers see siginificant growth in February
Most packaging and testing houses, including Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industry (SPIL), saw significant increases in sales in February, thanks...
Thursday 5 March 2009
IC backend suppliers see utilization recovering on white-box handset demand
IC packaging houses Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), and testing specialists Sigurd Microelectronics and King Yuan Electronics...
Monday 23 February 2009
Taiwan dollar depreciation boosting ASE and SPIL sales amid rising gold costs
The depreciation of the Taiwan dollar is expected to more than offset the extra costs from rising gold prices for Taiwan's packaging and testing houses who have high proportions of...
Friday 13 February 2009
ASE 1Q09 revenues to slide up to 40%; capex slashed
Advanced Semiconductor Engineering (ASE) has estimated that its sales in the first quarter of 2009 may drop 35-40% sequentially amid a continuing dim outlook. The wafer packaging...
Thursday 12 February 2009
Taiwan IC packaging and testing production value to drop 35% in 1Q09, says SPIL chairman
Bough Lin, chairman of Siliconware Precision Industries (SPIL), has estimated that the production value of Taiwan's IC packaging and testing industry will drop 35% sequentially in...
Wednesday 11 February 2009
Packaging and testing house SPIL in the red in 4Q08
Siliconware Precision Industries (SPIL) has announced that its revenues for the fourth quarter of 2008 were NT$12.45 billion (US$366 million), which represented a 27.8% decrease from...
Monday 9 February 2009
ASE and SPIL 1Q09 sales expected to fall; operating margins to hit bottom
Market watchers estimate that despite rush orders placed by handset manufacturers, Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) may suffer...
Tuesday 3 February 2009
ASE and SPIL still on line for 20-25% revenue drops in 1Q
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) are still expected to revenue drops in the 20-25% range in the the first quarter after the Taiwan...
Tuesday 13 January 2009
ASE, SPIL foresee orders not to rebound until March
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) are suffering through a low utilization rate for IC packaging/testing at about 40% currently,...
Thursday 8 January 2009
ASE and SPIL to see 20-30% sales decline in 1Q09
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have reported consolidated December sales of NT$4.14 billion (US$125.16 million) and NT$2.65 billion,...
Tuesday 9 December 2008
SPIL and NPC see sharp sales decline in November
November sales of Siliconware Precision Inudstry (SPIL) and Nan Ya Printed Circuit Board (NPC) declined significantly because of order shrinkage since the end of October, and market...
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