IC packager Siliconware Precision Industries (SPIL) has announced revenues for second-quarter 2009 grew 53.6% sequentially to NT$14.14 billion (US$430 million), and margins for the...
IC packaging and testing houses estimate revenues will peak in the third quarter of 2009, and decline 10% in the fourth. Shipment forecasts from foundries show that fourth-quarter...
MediaTek's handset chip shipments are expected to reach 100 million units in the third quarter, hitting the company's record, and topping 350 million units in 2009, according to industry...
IC packaging and testing firms Advanced Engineering Semiconductor (ASE) and Siliconware Precision Industries (SPIL) are likely to outperform market watchers' expectation of 10% sequential...
Qualcomm's new platform Snapdragon is in the process of validation and volume production is scheduled for the end of the third quarter, which will help boost utilization rates of...
King Yuan Electronics Company (KYEC) has adjusted upward its capex budget for 2009 by 50% to NT$3 billion (US$91.66 million), which will be utilized for purchases of new test equipment...
Siliconware Precision Industries (SPIL) plans to merge with its 100%-owned subsidiary, Siliconware Investment Company, in order to simplify the group's structure and reduce its management...
IC packaging and testing companies have indicated that some driver IC customers have suggested raising backend manufacturing prices to speed up production. Chipbond Technology and...
IC backend supplier Siliconware Precision Industries (SPIL) has expressed interest in investing in the government-led Taiwan Memory Company (TMC) project, which is seeking investment...
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have started implementing their capex plans for 2009, with each placing orders for 200 wire bonders...
Taiwan's major IC packaging and testing houses, Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), have announced revenues for May 2009 increased...
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industry (SPIL) have fully utilized all wire bonders, with the former using 60-70% and the latter 70-80% of their...
Packaging and testing houses Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) saw sales continue improving in April, with narrower revenue drops...
Advanced Semiconductor Engineering (ASE) have announced its net loss for the first quarter of 2009 expanded to NT$1.57 billion (US$46.9 million), whereas Siliconware Precision Industries...
