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NEWS TAGGED SPIL
Thursday 29 April 2010
SPIL posts weaker-than-expected 1Q10 results
Chip packaging and testing house Siliconware Precision Industries (SPIL) saw net profits for the first quarter of 2010 decline 60% sequentially to NT$1.51 billion (US$48.31 million)...
Monday 26 April 2010
Market watchers upbeat on TSMC, UMC 2Q10
Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics Corporation (UMC) are expected to guide for mid to high single-digit revenue growth sequentially in the...
Thursday 8 April 2010
ASE 1Q10 revenues up on quarter, but SPIL down
Chip packaging and testing house Advanced Semiconductor Engineering (ASE) has reported consolidated revenues for the first quarter rose 42.8% sequentially to NT$37.56 billion. Meanwhile,...
Friday 19 March 2010
ChipMOS expects strong 1Q10
ChipMOS Technologies expects its revenues for the first quarter of 2010 to stay flat or increase by a single-digit percentage from the fourth quarter of 2009 thanks to increasing...
Friday 12 March 2010
Semiconductor firms step up hiring of new employees
Major Taiwan-based foundries and backend suppliers, including Taiwan Semiconductor Manufacturing Company (TSMC), United Microelectronics Corporation (UMC), Advanced Semiconductor...
Tuesday 9 March 2010
ASE February 2010 revenues up on month, but SPIL down
IC packaging and testing house Advanced Semiconductor Engineering (ASE) has announced revenues for February 2010 grew 1.1% sequentially to NT$4.67 billion (US$147 million). Meanwhile,...
Monday 1 March 2010
SPIL to drop out from LCD driver IC, DRAM segments; sell related equipment to ChipMOS
Siliconware Precision Industries (SPIL) has announced that it will take a 15.8% stake in ChipMOS Technologies in exchange for all of its of LCD driver IC packaging and testing equipment...
Friday 12 February 2010
Amkor to boost 1Q10 capex
Amkor Technology has said it plans to allocate a capex of US$100-125 million for the first quarter of 2010, a significant rise compared to US$69 million spent a year ago. The figure...
Thursday 11 February 2010
Greatek and TICP to step into copper-wire bonding in 2Q10
With Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) aggressively ramping production on copper-wire bond processes, second-tier Taiwan-based IC...
Tuesday 9 February 2010
Major IC backend houses report stronger-than-expected revenues for January
IC packaging specialist Advanced Semiconductor Engineering (ASE) saw consolidated revenues remain almost flat on month in January, whereas rival Siliconware Precision Industries (SPIL)...
Thursday 4 February 2010
Global IC packaging and testing industry looks to double-digit growth in 2010, says SPIL chairman
The global IC packaging and testing industry is expected to grow by a double-digit rate in 2010, according to Bough Lin, chairman of Siliconware Precision Industries (SPIL). In line...
Monday 1 February 2010
SPIL stepping up pace of copper wirebonder purchases
Siliconware Precision Industries (SPIL), which falls behind Advanced Semiconductor Engineering (ASE) in copper-wire bonding processes, plans to add an additional 400-600 copper wire...
Thursday 28 January 2010
UMC teams up with three others to seek government funding for MEMS project
United Microelectronics Corporation (UMC) has teamed up with Integrated Technology Express (ITE), Siliconware Precision Industries (SPIL) and King Yuan Electronics (KYEC) to jointly...
Friday 8 January 2010
ASE and SPIL to see strong 1Q10
IC packaging and testing houses Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) are expected to see revenues drop less than 5% sequentially in...
Thursday 7 January 2010
Spansion to strengthen ties with Taiwan backend partners, says executive
Spansion intends to enhance cooperation with its Taiwan-based partners such as Powertech Technology (PTI) and Siliconware Precision Industries (SPIL) in 2010, according to John Nation,...