United Test and Assembly Center (UTAC) has seen sales generated from copper wire bonding account for 20% of its total revenues, according to company CEO Lee Joon Chung. Apart from...
AMD reportedly plans to outsource wafer starts for its Fusion CPUs with integrated graphics to Taiwan Semiconductor Manufacturing Company (TSMC) using bulk 40nm process technology,...
Chip packaging and testing firm Advanced Semiconductor Engineering (ASE) has announced consolidated revenues for April 2010 totaled NT$14.66 billion (US$465.6 million), down 7.5%...
Chip packaging and testing house Advanced Semiconductor Engineering (ASE) has announced net profits of NT$3.395 billion (US$108 million) on consolidated revenues of NT$37.555 billion...
Chip packaging and testing house Siliconware Precision Industries (SPIL) saw net profits for the first quarter of 2010 decline 60% sequentially to NT$1.51 billion (US$48.31 million)...
Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics Corporation (UMC) are expected to guide for mid to high single-digit revenue growth sequentially in the...
Chip packaging and testing house Advanced Semiconductor Engineering (ASE) has reported consolidated revenues for the first quarter rose 42.8% sequentially to NT$37.56 billion. Meanwhile,...
ChipMOS Technologies expects its revenues for the first quarter of 2010 to stay flat or increase by a single-digit percentage from the fourth quarter of 2009 thanks to increasing...
Major Taiwan-based foundries and backend suppliers, including Taiwan Semiconductor Manufacturing Company (TSMC), United Microelectronics Corporation (UMC), Advanced Semiconductor...
IC packaging and testing house Advanced Semiconductor Engineering (ASE) has announced revenues for February 2010 grew 1.1% sequentially to NT$4.67 billion (US$147 million). Meanwhile,...
Siliconware Precision Industries (SPIL) has announced that it will take a 15.8% stake in ChipMOS Technologies in exchange for all of its of LCD driver IC packaging and testing equipment...
Amkor Technology has said it plans to allocate a capex of US$100-125 million for the first quarter of 2010, a significant rise compared to US$69 million spent a year ago. The figure...
With Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) aggressively ramping production on copper-wire bond processes, second-tier Taiwan-based IC...
The global IC packaging and testing industry is expected to grow by a double-digit rate in 2010, according to Bough Lin, chairman of Siliconware Precision Industries (SPIL). In line...
