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NEWS TAGGED SPIL
Tuesday 14 September 2010
SPIL enters LED packaging market
Siliconware Precision Industries (SPIL) has entered the LED packaging business and started LED shipments through wirebonding packaging technology to three US-based clients. It is...
Tuesday 7 September 2010
SPIL posts flat revenues in August
Siliconware Precision Industries (SPIL) saw sales stay almost flat sequentially in August 2010, according to data released by the company. Market watchers expect the chip packaging...
Wednesday 18 August 2010
Chip backend firms to see revenues rebound in August
Chip packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), and testing specialists King Yuan Electronics Company (KYEC) and Sigurd Microelectronics...
Friday 6 August 2010
IC packaging and testing firms post revenue gains in July
Several major Taiwan-based packaging and testing companies have reported sequential revenue gains for July 2010.
Tuesday 3 August 2010
SPIL announces equipment purchase
Siliconware Precision Industries (SPIL) has announced an equipment purchase worth NT$574.62 million (US$18 million) from Verigy, which mainly supplies automated test equipment.
Thursday 29 July 2010
SPIL on copper wirebonder buying spree
Siliconware Precision Industries (SPIL) has revealed that another 600 copper wirebonders will be installed at its production sites in China and Taiwan during the third quarter. Total...
Wednesday 28 July 2010
SPIL 2Q10 earnings below expectation
Chip packaging and testing company Siliconware Precision Industries (SPIL) saw second-quarter consolidated revenues grow by only 4.5% sequentially, missing market watchers' estimates...
Thursday 15 July 2010
IC packaging and testing houses turn conservative over 3Q10 outlook
Taiwan-based IC packaging and testing companies are conservative about the outlook for the third quarter after Intel projected a moderate revenue growth for the traditional peak season,...
Wednesday 7 July 2010
ASE posts monthly sales record in June
Chip packager Advanced Semiconductor Engineering (ASE) posted consolidated revenues of NT$16.26 billion (US$504.65 million) in June 2010, up 4.9% sequentially and hitting a new monthly...
Monday 5 July 2010
ASE, SPIL to feel constrained by capacity crunch
Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL) are likely to see constraints in fab capacity limit their abilities to support strong revenue growth...
Friday 25 June 2010
SPIL approves NT$21 billion for 2010 capex
The board of directors of Siliconware Precision Industries (SPIL) has approved plans to budget NT$21 billion (US$652 million) in capex for 2010, according to a company filing with...
Tuesday 22 June 2010
SPIL declines to comment on reported order for AMD CPUs
Chip packaging and testing service provider Siliconware Precision Industries (SPIL) has declined to comment on reports that it has received a large order from AMD for CPUs, according...
Thursday 17 June 2010
SPIL to raise 2010 capex budget for copper wire bonding equipment procurement
Chip packaging house Siliconware Precision Industries (SPIL) will raise 2010 capex budget by at least 30% from US$450 million to about US$585 million due to increased procurement...
Tuesday 8 June 2010
ASE, SPIL May revenues up on month
Chip packaging and testing houses Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL) saw their consolidated revenues for May 2010 grow 5.7% and 2.9%...
Wednesday 19 May 2010
Chip packagers reportedly to raise quotes on gold costs
Higher gold prices have prompted chip packaging houses to consider transferring rising material costs to customers. Advanced Semiconductor Engineering (ASE) started adjusting quotes...