Siliconware Precision Industries (SPIL) has announced an equipment purchase worth NT$574.62 million (US$18 million) from Verigy, which mainly supplies automated test equipment.
Siliconware Precision Industries (SPIL) has revealed that another 600 copper wirebonders will be installed at its production sites in China and Taiwan during the third quarter. Total...
Taiwan-based IC packaging and testing companies are conservative about the outlook for the third quarter after Intel projected a moderate revenue growth for the traditional peak season,...
Chip packager Advanced Semiconductor Engineering (ASE) posted consolidated revenues of NT$16.26 billion (US$504.65 million) in June 2010, up 4.9% sequentially and hitting a new monthly...
Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL) are likely to see constraints in fab capacity limit their abilities to support strong revenue growth...
The board of directors of Siliconware Precision Industries (SPIL) has approved plans to budget NT$21 billion (US$652 million) in capex for 2010, according to a company filing with...
Chip packaging and testing service provider Siliconware Precision Industries (SPIL) has declined to comment on reports that it has received a large order from AMD for CPUs, according...
Chip packaging house Siliconware Precision Industries (SPIL) will raise 2010 capex budget by at least 30% from US$450 million to about US$585 million due to increased procurement...
Chip packaging and testing houses Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL) saw their consolidated revenues for May 2010 grow 5.7% and 2.9%...
Higher gold prices have prompted chip packaging houses to consider transferring rising material costs to customers. Advanced Semiconductor Engineering (ASE) started adjusting quotes...
United Test and Assembly Center (UTAC) has seen sales generated from copper wire bonding account for 20% of its total revenues, according to company CEO Lee Joon Chung. Apart from...
AMD reportedly plans to outsource wafer starts for its Fusion CPUs with integrated graphics to Taiwan Semiconductor Manufacturing Company (TSMC) using bulk 40nm process technology,...
Chip packaging and testing firm Advanced Semiconductor Engineering (ASE) has announced consolidated revenues for April 2010 totaled NT$14.66 billion (US$465.6 million), down 7.5%...
Chip packaging and testing house Advanced Semiconductor Engineering (ASE) has announced net profits of NT$3.395 billion (US$108 million) on consolidated revenues of NT$37.555 billion...
