Demand for copper wirebonding machines from IC backend service companies is expected to decline 50% in the fourth quarter of 2012 as compared to purchases in the third quarter, according...
Most Taiwan-based IC packaging and testing firms including Advanced Semiconductor Engineering (ASE), Silicon Precision Industries (SPIL) and Powertech Technology (PTI) all plan to...
The production value of Taiwan's copper wirebonding segment is expected to rise along with demand over the next three years, according to sources at equipment suppliers.
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), two Taiwan-based providers of IC packaging and testing service, saw consolidated revenues of...
Advanced Semiconductor Engineering (ASE), Amkor Technology and Siliconware Precision Industries (SPIL) – the world's leading packaging and testing houses – have all set...
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have made progress toward the transition from gold to copper wire bonding, and have also stepped...
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) both expect their third-quarter sales to register another sequential growth buoyed by rising demand...
IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) both saw their second-quarter net profits rise over 50% sequentially along with higher...
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have reported decreases in June consolidated revenues from the previous month of 1.7% and 5.9%,...
With shipments from upstream chipmakers rising, most Taiwan-based packaging and testing houses are expected to post sequential growth in third-quarter sales.
Siliconware Precision Industries (SPIL), a Taiwan-based provider of IC packaging and testing services, will invest US$20.50 million for a 42.27% stake in Microcircuit Technology Pte...
IC packaging and testing firms Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have both reiterated their commitment to expand capacity in 2012...
IC packager Siliconware Precision Industries (SPIL) is stepping up capacity expansion efforts in 2012 with planned capital expenditure of a record NT$17.5 billion, chairman Bough...
Major Taiwan-based IC packaging and testing houses including Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL), Powertech Technology (PTI) and Chipbond...
IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) both saw their May revenues register single-digit growth.
