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Thursday 22 August 2024
EgisTec exploring cloud AI prospects
Taiwanese IC design company Egis Technology (EgisTec) is actively exploring innovative opportunities in the cloud AI market through a collaboration with Arm.
Wednesday 21 August 2024
xMEMS unveils revolutionary cooling SoC for AI devices
US-based xMEMS Labs has developed the XMC-2400 µCooling™, a single-chip (SoC) air-cooled all-silicon active cooling solution utilizing semiconductor micro-electro-mechanical...
Wednesday 21 August 2024
Taiwan-based manufacturers anticipate Metalens adoption in iPhone 16
As smartphone camera resolutions continue to improve, lenses inevitably become thicker, impacting the weight of the devices. Market rumors suggest that Apple has been researching...
Wednesday 21 August 2024
Harnessing photons as the next frontier in information technology
There are four fundamental forces in nature, ranked from strongest to weakest: strong interactions, electromagnetic interactions, weak interactions, and gravity. While nuclear energy...
Tuesday 20 August 2024
FOPLP v CoWoS: the next frontier for advanced chip packaging
As the application scope of genAI grows so does the market for its chips, with forecasts predicting explosive growth in the coming years.
Tuesday 20 August 2024
Apple modem chip for iPhone unlikely in 2025
Latest rumors have it that Apple is ready to equip the iPhone with its in-house developed modem chip in 2025, but industry sources remain skeptical. Even if Apple was able to roll...
Monday 19 August 2024
Intel's 18A under fire: struggling yields, skepticism, and a race against TSMC
Intel has been attempting to shift the narrative to a more positive light following the company's "gruesome" series of trainwrecks that saw a disappointing second-quarter 2024 earnings...
Monday 19 August 2024
Weekly news roundup: Japan's breakthrough in EUV tech; China gaining self-sufficiency in chip equipment except in exposure tools
These are the most-read DIGITIMES Asia stories in the week of August 12 – August 16.
Monday 19 August 2024
Competitive color technologies expand e-paper market potential, moving beyond zero-sum game, says DIGITIMES Research
As the color e-paper market evolves with electrophoretic, cholesteric liquid crystal (CLC), and reflective TFT-LCD technologies competing for their shares, DIGITIMES Research analyst...
Monday 19 August 2024
China tightens antimony exports, raising supply concerns
China's Ministry of Commerce announced that it will expand its export controls to include antimony, a rare metal crucial for semiconductor materials. Beginning September 15, Chinese...
Monday 19 August 2024
TI to receive up to US$1.6 billion in CHIPS Act funding
Texas Instruments (TI) and the US Department of Commerce have signed a non-binding preliminary memorandum of terms for up to US$1.6 billion in proposed direct funding under the CHIPS...
Friday 16 August 2024
Showcasing dual expertise in technology and architecture, DataVan expands into smart building sector
As the wave of smart technology sweeps across industries, leveraging digital platforms to enhance operational efficiency and innovate business models has become a key strategy for...
Friday 16 August 2024
E Ink sees potential in E-paper billboard markets
After navigating through inventory challenges, E Ink Holdings (E Ink) has seen positive growth in the field of consumer electronics (CE) and Internet of Things (IoT), with expected...
Thursday 15 August 2024
Samsung reportedly introducing high-NA equipment by end of 2024 to catch up in EUV
Samsung Electronics is reportedly set to introduce high-numerical aperture (High-NA) extreme ultraviolet (EUV) equipment by the end of 2024.
Thursday 15 August 2024
TXC sees automotive product sales account for over 20% of revenue
TXC, a Taiwan-based quartz component supplier, expects automotive product sales to account for more than 20% of revenue in 2024.