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Thursday 31 October 2024
UMC sees falling fab utilization and gross margin in 4Q24
Pure-play foundry United Microelectronics (UMC) anticipates a decline in both its fab utilization rate and gross margin in the fourth quarter of 2024, and has lowered its capital...
Wednesday 30 October 2024
China pushing domestically developed AI chips and deployment of RISC-V structure, says DIGITIMES Research
DIGITIMES Research observes that China is rapidly advancing in the field of LLMs. Major technology giants such as Baidu, Alibaba, and Tencent have launched their self-developed LLMs...
Wednesday 30 October 2024
Infineon unveils ultra-thin 20-micrometer power semiconductor wafer
Infineon Technologies has disclosed its latest milestone in semiconductor manufacturing technology, following the announcement of the world's first 300-millimeter GaN power wafer...
Wednesday 30 October 2024
Samsung set to introduce high-NA EUV equipment by early 2025
Samsung Electronics is reportedly preparing to introduce its first High-NA EUV (extreme ultraviolet lithography) equipment in early 2025, signaling a major advancement for the South...
Wednesday 30 October 2024
Chinese EV makers rush EU shipments ahead of 35% tariff initiation
Chinese electric vehicle manufacturers are accelerating their European shipments ahead of potential anti-subsidy tariffs of up to 35% that could take effect from November 1. While...
Wednesday 30 October 2024
Samsung enters the SiPh race with I-Cube So/Eo, challenging TSMC and China's rising stars
Samsung Electronics and TSMC are ramping up the development of SiPh technology to handle the exponential data growth driven by AI applications. The Seoul Economic Daily reports...
Wednesday 30 October 2024
Glass substrates poised to transform advanced packaging: Q&A with Corning commercial technology director Xavier Lafosse
The rapid development of AI has dramatically increased demand for AI chips, but current organic substrate technology faces challenges, including thermal expansion mismatches and warping,...
Wednesday 30 October 2024
Nikon to enter back-end semiconductor exposure equipment market with photomask-free technology
Nikon has announced plans to launch exposure equipment for the back-end semiconductor process in fiscal year 2026 (April 2026 to March 2027), utilizing a photomask-free approach,...
Wednesday 30 October 2024
Server ODMs focus on leak-proof liquid cooling solutions, says DIGITIMES Research
DIGITIMES Research believes that liquid cooling technology is transforming the server cooling supply chain ecosystem. Various industry players are actively positioning themselves...
Wednesday 30 October 2024
BigGo's merchandise search technology well-received in Taiwan and SEA
In today's flourishing e-commerce landscape, consumers are accustomed to comparing products and their prices across various shopping websites on their computers or mobile phones,...
Wednesday 30 October 2024
Innolux adapts production with 'trade-in' policy amid weaker demand
Display panel leader Innolux posted an operating loss in the third quarter of 2024, though the company managed to stay profitable after taxes. Looking ahead to the fourth quarter,...
Wednesday 30 October 2024
Loongson to tape out GPU as early as 2025
According to industry reports, China-based CPU developer Loongson Technology is expected to tape out a general-purpose GPU as early as 2025. Reportedly, this GPU will be built using...
Tuesday 29 October 2024
South Korean expat detained in China over alleged semiconductor espionage under new spy law
A South Korean expatriate has been arrested and detained in China on suspicion of engaging in espionage activities, marking the first arrest of a South Korean national since the implementation...
Tuesday 29 October 2024
Australian AI chip startup AIcraft builds Asia supply chain, starting in Taiwan
Australian artificial intelligence chip startup AIcraft is expanding its footprint in Asia-Pacific, betting on partnerships with Taiwanese technology firms to strengthen its position...
Tuesday 29 October 2024
Japanese companies develop 3D analog IC for ADAS, overcoming cost and technical challenges
Oki Electric Industry and Nisshinbo Micro Devices have announced the development of an analog IC for advanced driver assistance systems (ADAS) in vehicles, reports Nikkei.