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Wednesday 31 July 2024
FuriosaAI and GUC partner on RNGD, most efficient AI accelerator for LLMs
FuriosaAI Inc. is pleased to announce its collaboration with GUC (Global Unichip Corporation) as a key partner on the secondgen AI accelerator, RNGD (pronounced "Renegade"), the most...
Wednesday 31 July 2024
ACM launches Ultra C vac-p flux cleaning tool for chiplets, breaking into FOPLP market
ACM Research has introduced its Ultra C vac-p flux cleaning equipment, specifically designed for fan-out panel-level packaging (FOPLP). This new tool employs vacuum technology to...
Wednesday 31 July 2024
Gus Technology to set up EV battery plant in Indonesia to expand global reach
Gus Technology, a Taiwanese battery OEM and custom battery service provider, has announced plans to build an electric vehicle battery manufacturing plant in Indonesia. This move is...
Wednesday 31 July 2024
CyberLink embraces Generative AI to rival Adobe in content creation
At CyberLink's Q2 earnings call, Chairman and CEO Jau Huang outlined the company's strategy to integrate generative AI and AI PC technologies into its software suite. Huang acknowledged...
Wednesday 31 July 2024
Biden administration responds to packaging and testing industry as Amkor receives subsidies from CHIPS Act
The Biden Administration has announced that the CHIPS and Science Act will subsidize US$400 million to help Amkor, the largest semiconductor packaging and testing company in the US,...
Wednesday 31 July 2024
Micron starts shipping 9th-gen TLC NAND in SSDs
Micron Technology has announced that it is shipping ninth-generation (G9) TLC NAND in SSDs, making it the first in the industry to achieve this milestone.
Wednesday 31 July 2024
PTI gearing up for AI SoC boom with FOPLP
Backend house Powertech Technology (PTI), with its fan-out panel-level packaging (FOPLP) technology, is targeting AI SoC market potential, and expects AI-related revenue to account...
Wednesday 31 July 2024
SDC, LGD to advance OLEDoS microdisplay with tandem OLED technology
Samsung Display (SDC) and LG Display (LGD) are planning to incorporate their tandem OLED technology into OLEDoS (OLED on Silicon) solutions for next-generation micro OLED displays,...
Wednesday 31 July 2024
AMD MI300 quarterly revenue surpasses US$1 billion, revises upward data center GPU revenue for 2024
AMD announced that its MI300 revenue reached US$1 billion in a single quarter.
Tuesday 30 July 2024
SK Hynix invests US$6.77 billion in Yongin Semiconductor Cluster, to prioritize DRAM production
SK Hynix has announced board approval for a KRW9.4 trillion (approximately US$6.77 billion) investment to construct its first plant and related operational facilities at the Yongin...
Tuesday 30 July 2024
LG Innotek showcases AR glasses with Waveguide technology, targets metaverse
LG Innotek recently showcased a prototype of AR glasses equipped with waveguide technology, garnering significant attention.
Tuesday 30 July 2024
China accelerates HBM production for AI, CXMT expands for self-sufficiency amid sanctions
China is ramping up its efforts to produce High-Bandwidth Memory (HBM), crucial for advancing AI technology, as part of its supply chain indigenization strategy.
Tuesday 30 July 2024
LG Innotek to enter GCS market, following Samsung and SK
Glass Core Substrate (GCS) is becoming a trend that major players in the semiconductor supply chain are avidly pursuing. LG Innotek is reportedly contacting material, components,...
Tuesday 30 July 2024
Infineon escalates legal battle against Innoscience over GaN patents
On July 23, 2024, Infineon Technologies AG expanded its ongoing lawsuit in the U.S. District Court for the Northern District of California, adding claims against Innoscience (Zhuhai)...
Tuesday 30 July 2024
Singapore becomes biggest buyer of Taiwan's technologies, says MOEA
Taiwan's Ministry of Economic Affairs (MOEA) released a report on July 29 revealing intriguing insights into Taiwan's R&D investment and technology export trends. The report highlighted...