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Friday 1 November 2024
Luxembourg space startup seeks EUR30M for global 5G IoT satellite expansion
Luxembourg-based satellite telecom operator OQ Technology is testing investor appetite for space-based Internet of Things (IoT) technology, seeking EUR 30 million in fresh funding...
Friday 1 November 2024
Photonic computing: a promising future
Photonic computing is experiencing renewed interest, driven by the growing demands of AI computations. The Mach-Zehnder Interferometer (MZI) serves as a cornerstone of Photonic Integrated...
Friday 1 November 2024
LG aims to rank among top 3 in global medical monitor market within 5 years
LG Electronics is following Samsung's lead in pursuing the lucrative medical technology field as a key future revenue source. The company plans to develop its medical technology business,...
Friday 1 November 2024
Taiwan Europe Chip Innovation Forum takes place in Prague with top 3 global EDA players
Taiwan Europe Chip Innovation Forum (TECIF), funded by Taiwan's National Science and Technology Council and executed by the Taiwan Semiconductor Research Institute (TSRI), commenced...
Friday 1 November 2024
AUO reports 10 consecutive quarters of losses, optimistic about growth in 2025
Panel manufacturer AUO has announced its tenth consecutive quarter of losses in the third quarter of 2024, despite revenue growth. The company maintains a negative forecast for the...
Friday 1 November 2024
Authme's face recognition technology safeguards against Deepfake attacks, ensuring the reliability of identity verification
Although AI has become a powerful tool helping companies gain a competitive advantage, advances in AI technology are also making AI-generated attacks such as Deepfake rapidly mature,...
Friday 1 November 2024
China SiC industry faces restructuring; Taiwan firms seek differentiation
With SiC production capacity rising in China, prices have fallen dramatically, potentially leading to a restructuring of China's SiC industry and prompting Taiwan-based players to...
Friday 1 November 2024
Intel CEO to visit TSMC in November, say sources
Intel CEO Pat Gelsinger will visit TSMC in Taiwan in November, according to industry sources, who also believe that recent media claims about TSMC withdrawing the Intel discount are...
Thursday 31 October 2024
Could South Korea's interests be behind US potential sanctions targeting Chinese display firms?
John Moolenaar, Chairman of the House Select Committee on the Strategic Competition Between the US and China, has recently written to Defense Secretary Lloyd Austin regarding China's...
Thursday 31 October 2024
Tesla FSD technology advances but faces challenges
Tesla's latest announcement regarding its self-driving taxi (Robotaxi) has attracted worldwide interest, indicating a significant advancement in its Full Self-Driving (FSD) technology...
Thursday 31 October 2024
Ennostar leverages Micro LED for AI optical communication and short-range transmission
Micro LED technology is emerging as a promising solution for high-speed AI data transmission and SiPh-based optical communication. Dr. David Su, Chief Strategy Officer of Ennostar,...
Thursday 31 October 2024
GF aims to revitalize foundry business in China with team expansion planned for 2025
GlobalFoundries (GF) is looking to revitalize its operations in China. K.C. Ang, who became GF's president for Asia and chairman for China earlier this year, recently said at an annual...
Thursday 31 October 2024
Technology behind cryptocurrency casino bonuses: technical analysis of blockchain gaming
Blockchain technology has fundamentally transformed how digital transactions and smart contracts operate across multiple industries. While initially known for cryptocurrencies, blockchain's...
Thursday 31 October 2024
DuPont and Zhen Ding form strategic partnership to develop high-end PCB technology
DuPont and Zhen Ding Technology have announced the establishment of a strategic cooperation agreement in the field of advanced PCB technology. Charles Shen, chairman of Zhen Ding,...
Thursday 31 October 2024
Samsung, SK Hynix, Intel put packaging at the heart of future innovation
At SEDEX 2024 in Seoul, Samsung Electronics, SK Hynix, and Intel showcased advanced packaging technologies as essential for future semiconductor innovations. With a focus on AI and...