CONNECT WITH US
NEWS TAGGED ADVANCED PACKAGING
Monday 25 April 2022
Demand for HPC chip analysis, inspection stays strong
Demand for HPC chip analysis and inspection remains robust in the second quarter of 2022, according to industry sources in Taiwan, where major pure-play foundries and OSATs operate...
Friday 22 April 2022
TSMC sets timetable to commercialize 2nm GAA process in 2025
TSMC has set a timetable to move its 2nm GAA process to production in 2025 while commercializing its 3nm FinFET process with improved yield rates in the second half of 2022, with...
Thursday 21 April 2022
Non-foundry IC segments gaining weight in HPC era, says DIGITIMES Research
Apple has become a bellwether in the HPC chip segment by rolling out its high-performance M1 series built using advanced process at its foundry partner, but all other manufacturing...
Wednesday 20 April 2022
ASE gearing up for HPC chip boom
OSAT ASE Technology with its fan-out chip on substrate (FOCoS) packaging technology is gearing up for a boom in HPC chip demand, eyeing orders from major processor vendors including...
Monday 18 April 2022
TSMC to see HPC chip orders contribute over NT$700 billion to 2022 revenue
TSMC is expected to see revenue generated from the HPC sector contribute more than NT$700 billion (US$23.9 billion) to the pure-play foundry's total revenue this year, according to...
Thursday 24 March 2022
China OSAT growing advanced packaging capability
Having hired R&D talent from Huawei's HiSilicon, China's leading OSAT Jiangsu Changjiang Electronics Technology (JCET) has been developing its flip-chip(FC) packaging, 2.5D IC,...
Monday 21 March 2022
TSMC may triple CoWoS material purchases for Nvidia new HPC chips
Nvidia is set to launch new HPC GPU platforms for datacenter, AI and gaming applications in 2022, and its manufacturing partner TSMC reportedly is expected to triple order placements...
Thursday 10 March 2022
TSMC, Unimicron to offer production solutions for Apple M1 Ultra
Apple has just unveiled its M1 Ultra SoC built using in-house-developed UltraFusion packaging architecture, which will be fabricated by TSMC with a 5nm process node and advanced packaging...
Thursday 17 February 2022
TSMC board approves nearly US$21 billion for capacity expansion
The board of Taiwan Semiconductor Manufacturing Company (TSMC) approved recently capital appropriations of about US$20.94 billion for the installation and upgrade of advanced technology...
Tuesday 15 February 2022
MCU specialist Nuvoton set to embrace strong 2022
Nuvoton Technology remains optimistic that its shipments of 32-bit MCUs, server baseboard management controllers (BMCs), automotive battery management ICs (BMICs), and power management...
Friday 11 February 2022
ASE expects auto chip backend biz to hit over US$1 billion in 2022
Taiwan's leading OSAT ASE Technology expects revenues from backend services for automotive chips to break a landmark level of US$1 billion in 2022 after growing 60% on year in 2021...
Friday 11 February 2022
Foundry capacity expansion projects may face delays
The ongoing COVID-19 pandemic has caused bottlenecks in labor relations, transport, and logistics operations worldwide, which may lead to delays in foundries' installation of new...
Wednesday 26 January 2022
With high revenue in 1Q22, PTI considers deals with Micron, SK Hynix
Backend house Powertech Technology (PTI) expects to post a double-digit on-year revenue surge in the first quarter of 2022 after posting record business results for 2021, and is optimistic...
Monday 24 January 2022
TSMC reportedly to build new advanced packaging fab in southern Taiwan
TSMC reportedly is planning to build a new advanced packaging plant in Chiayi or Yunlin county, southern Taiwan as it is fast revising its production roadmaps in response to rapid...
Monday 10 January 2022
AMD latest 3D desktop processor to adopt TSMC SoIC technology
AMD has launched its first 3D desktop processor for the consumer segment at CES 2022, which is expected to be fabricated by TSMC using 3D SoIC (system on integrated chips) technology,...