SK Hynix has advanced the groundbreaking of its first-phase Yongin Semiconductor Cluster plant (Yongin 1) from March 2025 to late February 2025 after the Yongin Special City government...
The Taiwan Semiconductor Research Institute (TSRI), under the National Science and Technology Council (NSTC), announced at a press conference held by Taiwan's National Applied Research...
The global AI boom is set to keep high bandwidth memory (HBM) in short supply through 2025, as demand surges across AI and data-intensive applications, according to experts at SEMICON...
As AI applications advance, the demand for high-performance and energy-efficient memory is growing across on-device AI, high-performance computing (HPC), and data centers. In response,...
SK Hynix CEO Noh-Jung Kwak, reflecting on the emergence of China's DeepSeek, predicts that the generative AI model will ultimately have a positive impact on the semiconductor industry...
Memory firms are stepping up recruitment efforts, as global demand intensifies for manpower supporting development of semiconductors for AI applications.
China's memory industry is making remarkable progress, substantially closing the technology gap with South Korea in DRAM and NAND flash manufacturing. The country has also achieved...
SK Hynix is reportedly expanding its production of fifth-generation, 12-layer HBM3E, with Hanmi Semiconductor and ASMPT expected to lead in equipment orders. Hanmi is set for growth...
SK Hynix has reportedly appointed Vice President Woong-sun (William) Lee to head its newly established semiconductor packaging facility in the US. His leadership will be closely watched...
Chip manufacturers are actively promoting price rises in the second quarter, leading to an expected rise in DRAM and NAND flash prices during this period.
The DRAM market is shifting as falling prices due to weak demand prompt top players like Samsung Electronics, SK Hynix, and Micron to adjust their strategies. These companies are...
Nippon Electric Glass (NEG) is increasing its production of carrier glass for advanced memory and semiconductor packaging due to the growing demand for generative AI, which has boosted...
Recent industry reports reveal that Micron is preparing to begin mass production of its 12-layer HBM3E memory for Nvidia, potentially creating significant pressure on Samsung Electronics...
ChangXin Memory Technologies (CXMT) has accelerated its next-generation DRAM development, transitioning from 17nm to 16nm process technology for its first DDR5 product, according...
