Taiwan-based makers have established an alliance targeting the supply of glass substrates, potentially a game changer for semiconductor packaging.

SK Hynix announced today that it has developed the industry's first 16Gb DDR5 built using its 1c node, the sixth generation of the 10nm process.

In recent years, advanced packaging has become increasingly crucial in high-performance computing, and Chinese OSAT companies, particularly Tongfu Microelectronics, are determined...

Samsung Electronics attended Gamescom 2024, held in Cologne, Germany. With an alleged largest-ever exhibition hall of about 800 square meters, Samsung unveiled its new gaming monitor,...

The semiconductor industry is experiencing a surge in demand for advanced packaging technologies, driven by the rapid growth of high-end AI servers and generative AI. This trend has...

JCET, a leading Chinese semiconductor packaging and testing services provider, has announced impressive financial performance for the first half of 2024. The company reported a significant...

Despite a recent downturn in the overall automotive market, suppliers of automotive components have reported a rise in revenue. This trend is particularly pronounced in the automotive...

Samsung Display (SDC) president Joo-sun Choi expressed strong confidence in the commercialization of Micro OLED.

Solomon Technology, a leader in AI and robotics solutions, has developed a powerful...

Mitsubishi Materials has announced the development of the world's largest rectangular silicon substrate, a technology gaining attention due to advancements in advanced packaging....

As the world enters the AI era for mobile devices, Samsung Display (SDC) and LG Display (LGD) both express optimism about the outlook of OLED technology. According to Lee...