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Monday 5 August 2024
Winbond scaling up DDR4 chip output
Winbond Electronics, a specialty DRAM and flash memory chipmaker, has begun ramping up its DDR4 chip output in the second half of 2024, with the memory output increase expected to...
Monday 5 August 2024
Huawei reportedly to introduce shared memory for next PC chip
Huawei reportedly mimics Apple by designing a chip with shared memory to improve its chip performance amid US sanctions and develop its in-house chip infrastructure ecosystem.
Monday 5 August 2024
AI agents drive profit potential in industrial tech
Despite its long presence in the market, AI has struggled to deliver a profitable model. Advantech Chairman K.C. Liu believes that the continuous wave of AI innovation over the past...
Monday 5 August 2024
China accelerates autonomous driving via multiple pilot cities, with Beijing, Shanghai, Wuhan leading the charge
China is keenly positioning itself as a global frontrunner in autonomous driving technology. Strong government support coupled with intense competition among major cities has cultivated...
Monday 5 August 2024
US plans to heighten controls on Chinese AI; South Korean and Chinese HBM manufacturers will be directly impacted
The US government is considering imposing restrictions as early as August to restrict China's access to crucial High Bandwidth Memory (HBM) chips and related manufacturing equipment...
Monday 5 August 2024
Intel's cost reduction plan only temporary fix amidst disappointing 2Q24
Intel reported a US$1.6 billion net income loss in the second quarter, a significant decline compared with the US$1.48 billion in net income it recorded during the same period in...
Friday 2 August 2024
CXMT begins mass producing HBM2: China aims to reclaim AI dominance?
China is attempting to produce High-Bandwidth Memory (HBM) in hopes of regaining control over AI, according to South Korean industry insiders.
Friday 2 August 2024
Geopolitics prompts IQE to step up global deployment
Compound semiconductor epitaxial wafer (epi-wafer) manufacturer IQE is swiftly adjusting its global strategy by expanding outside its UK base in response to geopolitical volatility...
Friday 2 August 2024
IQE Taiwan to launch IPO on TWSE
IQE, a leading British manufacturer of compound semiconductor epitaxial wafers (epi-wafer), has announced that its Taiwanese operating subsidiary IQE Taiwan will launch an initial...
Thursday 1 August 2024
E Ink and Himax unveil advanced color e-paper timing controller
E Ink Holdings (E Ink) and Himax Technologies (Himax) have jointly unveiled the next-generation color e-paper timing controller, an ASIC T-Con named T2000.
Thursday 1 August 2024
Shanghai unveils US$13.7 billion capital injection into IC, AI, and biopharma industries
Shanghai has announced the launch of the "Three Leading Industry Parent Funds," targeting integrated circuits (IC), biopharmaceuticals, and AI.
Thursday 1 August 2024
Kneron co-founder honored with inaugural Asian American Pioneer Medal for technological innovations
On July 27, at the Stanford Memorial Auditorium, Professor Mau-Chung Chang, co-founder of Kneron, a provider of edge AI solutions, was awarded the inaugural 2024 Asian American Pioneer...
Thursday 1 August 2024
Reasons why FOPLP fails to entice AUO to enter
FOPLP has emerged as the primary force in Innolux's transformation and has also gained significant attention since TSMC disclosed its intention to develop it. However, FOPLP is still...
Thursday 1 August 2024
AI servers to transform cooling supply chain, says AVC chairman
The server industry supply chain is undergoing a rapid transformation, with the most noticeable changes being in the shift toward liquid cooling from air cooling technology, driven...
Wednesday 31 July 2024
FuriosaAI and GUC partner on RNGD, most efficient AI accelerator for LLMs
FuriosaAI Inc. is pleased to announce its collaboration with GUC (Global Unichip Corporation) as a key partner on the secondgen AI accelerator, RNGD (pronounced "Renegade"), the most...