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NEWS TAGGED CHIPMOS
Thursday 12 October 2017
Himax reportedly supplying WLO chips for iPhone X face ID
Fabless IC firm Himax Technologies has begun shipments of chips based on wafer-level optics (WLO) technology to Apple, according to industry sources. The solution is reportedly a...
Monday 25 September 2017
Taiwan IC backend firms to enjoy strong 4Q17
A ramp-up of orders for communications chips, as well as TV panel-use driver ICs and TDDI (touch with display driver) chips, will enable Taiwan-based IC backend firms to enjoy a particularly...
Friday 25 August 2017
Chipbond, ChipMOS see rising orders for TDDI chips
Backend houses Chipbond Technology and ChipMOS Technologies have seen orders for TDDI (touch with display driver integration) chips for use in 18:9 smartphone panels ramp up, which...
Monday 14 August 2017
ChipMOS to enter production for 3D sensing components in 3Q17, says report
Backend house ChipMOS Technologies will enter production for 3D sensing components for new consumer electronics devices in the third quarter of 2017, according to a report by Taiwan's...
Thursday 10 August 2017
ChipMOS obtains backend orders from Novatek
ChipMOS Technologies has obtained backend orders for touch display driver ICs (TDDI) from Novatek Microelectronics, with shipments set to kick off in the fourth quarter of 2017, according...
Friday 28 July 2017
ChipMOS Shanghai obtains backend orders for NOR flash from XMC
ChipMOS Technologies (Shanghai), a joint venture between Taiwan-based ChipMOS and Tsinghua Unigroup, has obtained backend orders for NOR flash memory from Wuhan Xinxin Semiconductor...
Wednesday 19 July 2017
Chipbond reportedly to sell partial stake in China subsidiary to BOE
Speculation has circulated in the industry that Taiwan-based Chipbond Technology plans to sell part of its stake in its China-based subsidiary Chipmore Technology to BOE Technology...
Wednesday 19 July 2017
Chipbond, ChipMOS seeing robust gold bumping demand
Backend houses Chipbond Technology and ChipMOS Technologies have both cut into the supply chains of US and Korea smartphone brands with their gold bumping services, and are set to...
Wednesday 12 July 2017
Taiwan IC backend firms revenues to peak for 2017 starting August, September
Taiwan-based IC backend houses, particularly those engaged in the supply chain for Apple's upcoming iPhones, are expected to see their revenues start peaking for 2017 in August or...
Tuesday 4 July 2017
Taiwan backend firms gearing up for robust demand for TDDI chips
Demand for TDDI (touch with display driver integration) chips is set to boom starting the third quarter of 2017 which will buoy sales at related backend companies including Chipbond...
Monday 5 June 2017
Robust NOR flash demand to boost 3Q17 performance at backend firms
Taiwan-based backend service companies including ChipMOS Technologies, Walton Advanced Engineering and Lingsen Precision Industries are expected to post brisk revenue results for...
Wednesday 24 May 2017
ChipMOS reportedly lands gold bumping orders for AMOLED driver ICs from Samsung
ChipMOS Technologies reportedly has landed orders from Samsung Electronics for providing gold bumping services on 12-inch wafers fabricated to produce AMOLED driver ICs to be used...
Friday 12 May 2017
ChipMOS expects revenue growth in 2Q17
ChipMOS Technologies, a backend house targeting the LCD driver IC and memory chip sectors, expects rising sales generated from the LCD driver IC and mixed-signal chip sectors in the...
Thursday 20 April 2017
Macronix, Winbond, Richwave benefiting from use of OLED panels
Taiwan-based NOR flash suppliers Macronix International and Winbond Electronics are expected to see their revenues hit new highs in April due to increasing demand for NOR flash chips...
Tuesday 11 April 2017
ChipMOS 1Q17 revenues slip 2%
ChipMOS Technologies, a backend house targeting the LCD driver IC and memory chip sectors, saw its first-quarter revenues slip about 2% sequentially and outperform its estimate of...