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NEWS TAGGED PACKAGING
Friday 29 March 2024
SK Hynix sees key DRAM opportunity in HBM customization
SK Hynix is expanding the High Bandwidth Memory (HBM) contribution to its DRAM revenues and expects a deepening effect of the customization trend of HBM.
Thursday 28 March 2024
IC packaging materials distributor Niching sees brisk order visibility
Niching Industrial has observed clear order visibility for vapor chambers and silver paste materials.
Wednesday 27 March 2024
SK Hynix reportedly planning new packaging facility for HBM in the US
Following the plan to construct an advanced semiconductor packaging facility in Indiana, United States, SK Hynix recently detailed its site selection in West Lafayette, as reported...
Wednesday 27 March 2024
IC packaging materials supplier CWE obtains NT$3 billion syndicated loan
Chang Wah Electromaterials (CWE) has signed a five-year syndicated loan agreement for NT$3 billion (US$94 million) with 12 local banks in Taiwan, according to the semiconductor materials...
Wednesday 27 March 2024
Japan-based suppliers capitalize on emerging glass substrate as chipmakers embrace advanced packaging
As global chipmaking leaders like Intel are optimistic about introducing glass substrates for advanced IC packaging, Japan-based PCB suppliers are capitalizing on the emerging tech...
Tuesday 26 March 2024
India on right path in developing semiconductor ecosystem, says experts
Despite initial challenges, industry leaders and experts are optimistic that India is on a trajectory that aligns with developing a robust indigenous semiconductor industry.
Monday 25 March 2024
IC packaging and testing suppliers coping with electricity price hike
The Taiwanese government decided to raise electricity prices by an average of about 10% starting in April, with industrial electricity prices up by nearly 14%, the third consecutive...
Friday 22 March 2024
DDI backend firms look to OLED, auto displays for 2024 growth
Display driver IC (DDI) backend houses including ChipMos Technologies and Chipbond Technology are optimistic about the market prospects for OLED and automotive displays.
Thursday 21 March 2024
ASE expands VIPack advanced packaging solutions for AI device apps
Advanced Semiconductor Engineering (ASE), a member of ASE Technology Holding, has announced the expansion of its advanced interconnect technology on the VIPack platform. This development...
Wednesday 20 March 2024
Semiconductor system-level integration opens SLT opportunities for Taiwanese EMS providers amid AI boom
While chip design giants like Nvidia, AMD, and Intel prioritize "system-level" integration, all the six major Taiwanese EMS providers – Foxconn, Wistron, Compal, Quanta, Inventec...
Tuesday 19 March 2024
TSMC to build two advanced packaging fabs in southern Taiwan
TSMC plans to set up two new advanced packaging fabs in Chiayi, southern Taiwan, a high-ranking Taiwanese government official has announced.
Thursday 14 March 2024
Taiwanese IC distributors to capitalize on handset and PC inventory shrinkage, AI chip boom in 2024
Taiwan's major IC distributors, including WPG Holdings, WT Microelectronics, Supreme Electronics, and Edom Technology, anticipate several significant trends for 2024 in the semiconductor...
Thursday 14 March 2024
APT upbeat about orders for advanced packaging
AblePrint Technology (APT), a company specializing in pneumatic and thermal process solutions for semiconductor packaging, is optimistic about the growing demand for advanced packaging...
Thursday 7 March 2024
VCSEL component maker TrueLight attracts investment from Taiwan Mask
Photomask specialist Taiwan Mask Corporation has announced plans to participate in optical components supplier TrueLight's private placement, with a total investment of around NT$410...
Thursday 7 March 2024
CG-Renesas ATMP project in India to commence construction in mid-2024
In a recently announced chipmaking project in India in partnership with India and Thailand-based companies, Renesas expressed cautiousness about the investments by starting with ATMP...
CHT
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research