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Japan-based suppliers capitalize on emerging glass substrate as chipmakers embrace advanced packaging

Chiang, Jen-Chieh, Taipei; Jingyue Hsiao, DIGITIMES Asia Wednesday 27 March 2024 0

Credit: Dai Nippon Printing

As global chipmaking leaders like Intel are optimistic about introducing glass substrates for advanced IC packaging, Japan-based PCB suppliers are capitalizing on the emerging technology.

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