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IN THE NEWS
Friday 24 December 2021
Taiwan backend houses step up deployments for 3rd-gen semiconductors
GEM Services and Lingsen Precision Industries, which specialize in power component and module backend services, and RF component and module packagers Tong Hsing Electronic Industries...
Friday 24 December 2021
2021 Asia tech M&A deals and values hit new high
Technology merger and acquisition activities accelerated in 2021 and deals in Asia broke the US$100 billion mark for the first time in history, totaling US$137.3 billion, up 86.3%...
Thursday 23 December 2021
Highlights of the day: Memory demand from datacenters to rise in 1Q22
DRAM and NAND flash contract prices are poised to continue trending downward in first-quarter 2022, but memory demand...
Thursday 23 December 2021
GlobalWafers to ramp up production for 3rd-gen semiconductors in 2022
GlobalWafers, a subsidiary of solar wafer maker Sino-American Silicon Products (SAS), plans to more than double production capacity for third-generation semiconductors in 2022, according...
Thursday 23 December 2021
Taiwan IC design houses to accept foundry price hikes
Taiwan-based IC design houses including first-tier players are aware they will have to accept price increases proposed by pure-play foundries in order to obtain more available fab...
Thursday 23 December 2021
TAS sets up subsidiary for compound semiconductors
ProAsia Semiconductor (PASC), a wholly-owned subsidiary of Taiwan Asia Semiconductor (TAS, formerly Opto Tech), will be engaged in compound semiconductor R&D and production with...
Wednesday 22 December 2021
EMC to issue bonds for capacity expansion on IC substrate CCLs
Taiwan-based CCL manufacturer Elite Material (EMC) has disclosed plans to issue NT$3.5 billion (US$125.7 million) in convertible corporate bonds to fund its capacity expansion for...
Wednesday 22 December 2021
BESI lowers 4Q21 revenue due to severe flooding in Malaysia
Leading manufacturer of assembly equipment for the semiconductor industry, BE Semiconductor Industries N.V. (Besi) announced that due to flooding affecting its main production facility...
Wednesday 22 December 2021
High-end test interfaces badly needed for Wi-Fi 6E/7 chipsets
As Wi-Fi technology standards continue to advance from Wi-Fi 5 and Wi-Fi 6/6E to Wi-Fi 7, high-frequency and mixed-frequency chips testing interfaces are badly needed to help chipmakers...
Wednesday 22 December 2021
Top 10 semiconductor news in 2021
The semiconductor industry experienced a dramatic year in 2021 - climate crises, pandemic, fire at a Japanese chip factory, geopolitical tension, and automakers' decision-making error...
Wednesday 22 December 2021
Semiconductor equipment billings hit record high in November 2021
Billings among North American manufacturers of semiconductor production equipment climbed to a record high of US$3.93 billion in November 2021, according to SEMI.
Wednesday 22 December 2021
High-end IC testing demand to stay robust in 2022
Testing demand for HPC chips, mobile application processors, wireless connectivity chips, and other high-end logic chips will stay strong in 2022, according to sources at Taiwan-based...
Wednesday 22 December 2021
Seventeen semiconductor companies to see 2021 revenue top US$10 billion
IC Insights has forecast that 17 companies will have worldwide semiconductor (IC and OSD - optoelectronics, sensor, and discrete) sales of more than US$10.0 billion in 2021.
Wednesday 22 December 2021
Unisoc adopts Imagination AI in 5G chips
Unisoc has used Imagination Technologies' Series3NX neural network accelerator (NNA) IP in its new smartphone 5G platforms - Tanggula T770 and T760 system-on-chips (SoC), according...
Wednesday 22 December 2021
Micron sees AI, 5G and EV drive memory demand growth
Memory and storage revenue has outpaced the rest of the semiconductor industry over the last two decades, according to Sanjay Mehrotra, president and CEO for Micron Technology, who...