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Tuesday 25 January 2022
PMIC suppliers developing peripheral chips for GaN devices
Several Taiwan-based power management integrated circuit (PMIC) specialists are looking to seize opportunities in the GaN power device market by developing related peripheral ICs,...
Tuesday 25 January 2022
Compal ranks as top notebook ODM with record revenues in 2021
Compal Electronics ended 2021 as Taiwan's top notebook ODM with its revenues rising 17.8% on year to a record high of NT$1.23 trillion (US$44.40 billion), and still expects a double-digit...
Monday 24 January 2022
Highlights of the day: TSMC fast expanding packaging capacity
TSMC is keen on advancing its 3D IC packaging technology. The foundry house reportedly is planning to build a new advanced...
Monday 24 January 2022
More record-high revenues for UMC, PSMC in 1Q22
Pure-play foundries United Microelectronics (UMC) and Powerchip Semiconductor Manufacturing (PSMC) are poised to see their revenues hit record highs in the first quarter of 2022,...
Monday 24 January 2022
Industry watch: Big issues must be addressed
Well known for industry clusters, Taiwan must think about developing a "Cluster 2.0" model, ASE COO Tien Wu has urged. How should it define the concept of "mutual home ground" across...
Monday 24 January 2022
Unisoc adopts Imagination NNA IP in new 5G smartphone chips
China's fabless chipmaker Unisoc has used Imagination's Series3NX neural network accelerator (NNA) IP in its Tanggula T770 and T760 system-on-chips (SoC) for 5G smartphones, according...
Monday 24 January 2022
Shanghai incentivizes development of IC equipment, EDA tools
The Shanghai municipal government has newly released a package of generous incentives to encourage investments in the development and production of semiconductor materials and equipment,...
Friday 21 January 2022
Compeq foresees intense high-end HDI PCB demand
Taiwan-based Compeq Manufacturing has expressed optimism about high-end HDI PCB demand in 2022, and expects its shipments for low-orbit satellites to double and to contribute 6-8%...
Friday 21 January 2022
Highlights of the day: Foldable smartphone will be a passing fad?
All the major smartphone providers, except Apple and Vivo, have announced they would release foldable smartphones in 2022. Among those brands, Samsung, Oppo, and Huawei already released...
Friday 21 January 2022
Asustek, Pegatron subsidiaries boost consolidated results
Asustek Computer and Pegatron have both seen their subsidiaries contribute considerably to their total revenues in 2021 and are optimistic about further revenue and profit gains driven...
Friday 21 January 2022
OmniVision enhances CIS in car, security applications
China's IC design industry has grown rapidly over the past two decades, and has gained a significant position in some segments such as CMOS image sensor (CIS) chips. Its leading CIS...
Friday 21 January 2022
MediaTek demos Wi-Fi 7 technology
MediaTek has showcased what the company claims is the world's first live demo of Wi-Fi 7 technology, and expects products with Wi-Fi 7 to hit the market starting in 2023.
Friday 21 January 2022
Wi-Fi 7 will spark demand for QFN packaging, burn-in testing
With chip vendors (including Broadcom, Intel, MediaTek, and Qualcomm) gearing up for the development of Wi-Fi 7 chip solutions, QFN packaging and burn-in testing demand will be ramping...
Friday 21 January 2022
Taiwan compound semi output value increases 26% in 2021
Taiwan's compound semiconductor output value grew about 26% on year to NT$83.5 billion (US$3 billion) in 2021, according to statistics compiled by the Photonics Industry & Technology...
Friday 21 January 2022
Hisense releases in-house-developed 8K AI image quality chip
TV vendor Hisense has released the Hi-View HV8107, an in-house-developed AI image quality chip for 8K TVs and the first model of its kind ever developed by any China-based company,...