UMC has informed clients of another round of price hikes in March 2022, following an about 10% rise in foundry service...

Small- to medium-size LCD panel and module maker Giantplus Technology has seen brisk order visibility for the first half of 2022, with industrial and niche-market products accounting...

MCU specialist Nyquest Technology has struck an agreement with Nuvoton Technology for sufficient foundry capacity over the next four years, according to the fabless chipmaker.

Broadcom and MediaTek are set to release their respective Wi-Fi 7 SoC series in the first half of 2022, looking to build a preemptive presence in the next-generation Wi-Fi segment...

The wide bandgap (WBG) features of third-generation semiconductors make them particularly suitable for recharging and radio frequency (RF) applications, as silicon carbide (SiC) has...

DIGITIMES estimates that it costs US$2.4 billion to build a 12-inch wafer fab using the 90nm process node with a monthly output of 50,000 wafers. The investment can reach US$6 billion...

Delivery lead times for Wi-Fi 6/6E core chips still last six months to one year although such chips are given shipment priority at vendors amid tight foundry capacity, and migrating...

The potential of compound semiconductors has been generating much interest. Win Semi chairman Dennis Chen recently...

Leading Taiwan-based IC design companies MediaTek, Novatek Microelectronics and Realtek Semiconductor have come under frequent speculation that their business will weaken, but related...

Apple is reportedly hiring talent to develop RF solutions, modem chips and other wireless semiconductors in house, sparking market concerns about possible impacts on its suppliers...

Dow (NYSE: Dow) will preview its latest silicone technologies for advanced semiconductor packaging at SEMICON Taiwan 2021 in Booth #I2616. These next-generation silicone-organic hybrid...

While compound semiconductor materials have been around for some time, they are generating significant interest from the industry lately for its potential to replace silicon as the...

The USB Type-C (USB-C) interface is expected to become standard in the 2022 notebook market, which will benefit Taiwan-based transmission interface, USB power delivery (PD) chip and...

A while back at a DIGITIMES-hosted seminar on the ICT industry's outlook in 2022, Tony Huang, deputy director of the DIGITIMES Research Center, pointed out that the regular safety...

Himax Technologies has announced that its second-generation automotive in-cell TDDI (touch and display driver integration), HX83192 series, entered mass production in the third quarter...