- 4 Mar 2014:
- 27 Feb 2014:Fujitsu, Docomo, NEC abandon development of smartphone chips (February 27) - Nikkei Electronics AsiaFujitsu, NTT Docomo and NEC will dissolve by March a joint venture for developing core chips for smartphones. The venture, Access Network Technology, was formed in August 2012 to develop baseband chips.
- GCT Semiconductor has licensed the Cadence Tensilica ConnX BBE16 digital signal processing (DSP) core for a next-generation chipset targeting mobile applications.
- JEDEC Solid State Technology Association has announced the publication of Release 6 of the DDR3 Serial Presence Detect (SPD) document. The updated standard describes new memory timing parameters and enables higher capacity memory modules.
- Qualcomm announces commercial 20nm LTE advanced chipset for automotive (February 24) - Company releaseThe Gobi 9x30 is the world's first commercially announced cellular modem for automotive based on the 20nm technology node with support for global carrier aggregation deployments up to 40MHz in both LTE FDD and TDD modes.
- 26 Feb 2014:Toshiba develops device controller for embedded NAND flash memory module compliant with JEDEC UFS Ver.2.0 standard (February 25) - Company releaseToshiba has developed what it claims is the world's fastest device controller for embedded NAND flash memory modules compliant with the Universal Flash Storage (UFS) Ver.2.0 and UFS Unified Memory Extension (UME) Ver.1.0 standards defined by JEDEC Solid State Technology Association (JEDEC).
- International Rectifier (IR) has commenced initial production at its new ultra-thin wafer processing facility in Singapore. Wafer thinning, metallization, testing and additional proprietary wafer level processing are undertaken at the new 60,000 square foot manufacturing site which receives processed wafers from IR's internal fabs and foundry partners.
- 25 Feb 2014:RF Micro Devices and TriQuint Semiconductor have announced a definitive merger agreement under which the companies will combine in an all-stock transaction. To reflect the nature of this transaction as a merger of equals, the new company will have a new name and shared leadership team.
- Qualcomm Snapdragon chipsets power new Samsung Galaxy S5 and Galaxy Grand 2 (February 25) - Company releaseThe Samsung Galaxy S5 features the Qualcomm Snapdragon 801 processor with integrated LTE. Additionally, the Qualcomm Snapdragon 400 processor is featured in the Samsung Galaxy Grand 2, bringing LTE connectivity in mainstream smartphones.
- InvenSense announces turnkey commercial grade wearable platform for health and fitness (February 24) - Company releaseInvenSense has announced a turnkey wearable platform solution intended to substantially shorten the time-to-market for any OEM or ODM.
- Hillcrest Labs brings advanced motion control to Oppo mobile devices (February 24) - Company releaseHillcrest Labs has announced that Oppo, a China-based CE manufacturer and smartphone OEM, is using Hillcrest's patented Freespace software to provide advanced motion-based functionality on their latest smartphones.
- 24 Feb 2014:Qualcomm has leaped ahead of Apple in 64-bit mobile chip development with its first eight-core Snapdragon 615 chip for mobile devices, which has integrated LTE and 4K video rendering capabilities.
- Renesas develops 28nm embedded flash memory technology for microcontrollers (February 18) - Company releaseRenesas Electronics has developed what it claims is the industry's first 28-nanometer (nm) flash memory intellectual property (IP) for microcontrollers (MCUs) using a 28nm process technology.
- 20 Feb 2014:Qualcomm is under investigation in China for allegedly overcharging and exploiting its market position, which will see the US chipmaker facing fines of over US$1 billion.
- 19 Feb 2014:South Korean multinational conglomerates Samsung and LG are considering setting up units to manufacture electronic chips in India, following the government's clearance to build two such semiconductor units.
- 17 Feb 2014:Samsung Electronics Co said a memory chip plant being built in China will start operations as planned in the first half of 2014 and the company will remain flexible about further investment in the factory.
- AMD is rolling out its server CPU platform based on ARM's 64-bit technology - the first of such collaboration between the two firms. The Opteron A1100 series chip, codenamed Seattle, is fabricated using 28nm process technology, and the chip maker plans to sample it this quarter.
- 14 Feb 2014:ARM enhances IP suite for 2015 mid-range mobile and consumer markets (February 11) - Company releaseARM has announced an enhanced suite of higher performance and more energy-efficient products specifically designed for the rapidly growing mid-range mobile and consumer electronics markets.
- 13 Feb 2014:Chipmaker Microchip Technology said it would buy Supertex for US$394 million in cash to bolster its business that supplies to the medical, LED lighting, industrial and telecommunication industries.
- 12 Feb 2014:Sony has entered negotiations with Apple to double its supply of camera components for a new iPhone slated to roll out as early as next year.
- 11 Feb 2014:Infineon projects higher sales as car and security units pick up (January 30) - Bloomberg (via Businessweek)Infineon Technologies has projected sales growth in its fiscal second quarter as orders for automotive and identity-checking components rise.
- ARM and SMIC broaden IP partnership with 28nm process for mobile and consumer applications (February 9) - Company releaseARM and SMIC have announced an agreement to offer the ARM Artisan physical IP platform for SMIC's 28nm poly SiON process to provide high-performance, high-density and low-power technologies for SoC designs.
- 10 Feb 2014:Struggling chip-maker Renesas Electronics will withdraw from the market for small liquid crystal displays as part of efforts to turn around its business, an industry source said Saturday.
- IBM is exploring a sale of its semiconductor business in what would be its most significant strategic move since it faced a financial crisis in the early 1990s.
- 6 Feb 2014:Both companies gain access to each other's industry-leading patent portfolios under the agreement, which covers a broad range of products and technologies.
- Under the terms of the licensing arrangement, Imagination will receive on-going license fees, and royalty revenues on shipment of SoCs (Systems on Chip) incorporating Imagination's IP.
- Cadence to enhance high-level synthesis offering with acquisition of Forte Design Systems (February 5) - Company releaseCadence Design Systems has entered into a definitive agreement to acquire Forte Design Systems, a provider of SystemC-based high-level synthesis (HLS) and arithmetic IP.
- 29 Jan 2014:Qualcomm may be hit with a record fine exceeding US$1 billion in a Chinese antitrust probe, raising the specter of harsh penalties for foreign firms facing an increasingly aggressive regulator.
- 28 Jan 2014:Sir John Buchanan, chairman of ARM, is preparing to step down from the role less than a year after the departure of long-term chief executive Warren East.
- 24 Jan 2014:The portfolio, comprising approximately 1,400 granted patents and pending patent applications from the US and approximately 1,000 granted patents and pending patent applications from other countries, covers technologies that include fundamental mobile operating system techniques.
- 23 Jan 2014:Flash memory card maker SanDisk has reported an increase in profits for the fourth quarter, due largely to higher revenues and strong margins.
- ASML CEO sees EUV machines reaching improved norms by 2017 (January 22) - Bloomberg (via Businessweek)ASML expects new extreme ultraviolet lithography machines to reach a production standard that satisfies all of its semiconductor-equipment customers by 2017, CEO Peter Wennink said.
- 22 Jan 2014:AMD on Tuesday said it will be sampling 64-bit ARM system-on-a-chip (SoC) products to customers this quarter and is "on track to launch one of the industry's first 64-bit ARM server SoCs in 2014."
- Intel confirms using ARM-based chip core in smartwatch it demoed at CES (January 21) - ComputerworldFor years, Intel has been battling to replace ARM-based chips used in smartphones and other mobile devices. Now it has partly succumbed to the low-power ARM approach.
- The chipmaker announced that it was cutting 1,100 jobs in the US, India and Japan as it moves to "reduce investments in markets that do not offer sustainable growth and returns."
- AMD was profitable for the second consecutive quarter, thanks in large part to the success of the gaming consoles from Microsoft and Sony that are powered by the vendor's chips.
- Renesas Electronics will slash 5,400 jobs in Japan, or about one quarter of its domestic workforce, reports said Wednesday, as the struggling Japanese chipmaker overhauls its money-losing business.
- Knowles Corporation celebrates 40th anniversary in Taiwan, showcasing multiple innovative solutions
- Advantest announces newest handler for testing advanced memory ICs
- CEVA offers total solutions for the multi-billion-dollar IoT market
- Seizing IoT opportunities, CEVA acquires RivieraWaves
- NXP appoints new VP, Taiwan Sales and Country Manager
- Embracing the New Generation Intel Atom Family with DDR3 Memory Support
- Got The Message? Ensuring efficient and reliable delivery of content across a mission critical digital signage network
- Emb' Store On-Demand Software Service for Embedded Computing
- Efficient Network Management for Digital Signage
- Design Benefits of the MI/O Extension Solution
- Perforce Software Introduces Perforce Swarm
- Perforce Unveils Git Fusion, Improving Git Experience
- ATO Solution Co., Ltd. to launch 1Gb SLC NAND Flash after 256Mb/512Mb mass production for the first time in Fab-less industry
- Chilisin's miniature power inductor in 0603/0805 sizes
- Chilisin introduces Thin-film chip inductor 0201 size
- Digitimes Research: MediaTek, Rockchip to join Chromebook market
- Digitimes Research: Intel looking to promote x86 architecture to China chip designers
- Digitimes Research: Hisilicon AP to give Huawei cost advantage in high-end mobile device market
- Digitimes Research: Google looking to clean up Android device mess in emerging markets
- Digitimes Research: Qualcomm far ahead of Marvell and MediaTek in China LTE market
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