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Chipbond 3Q12 sales driven by demand for small-size panel driver ICs

Ingrid Lee, Taipei; Jessie Shen, DIGITIMES Asia Tuesday 21 August 2012 0

Consolidated revenues at Chipbond Technology are set to increase 5-10% sequentially in the third quarter of 2012, driven by strong demand for its 12-inch bumping services used for small- to medium-size panel driver ICs, according to market watchers.

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