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Unimicron to pour US$20 billion into FC substrate biz over next 4 years

Jay Liu, Taipei; Jessie Shen, DIGITIMES Asia Monday 13 May 2019 0

Unimicron Technology has disclosed plans to invest a total of NT$20 billion (US$644.7 million) in R&D and expanding production capacity for advanced flip-chip (FC) substrates through 2022 to tap business opportunities arising from 5G, artificial...

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