CONNECT WITH US

Kinsus to expand production capacity for ABF substrates in 2022, 2023

Jay Liu, Taipei; Willis Ke, DIGITIMES Asia 0

Credit: Kinsus

Kinsus Interconnect Technology is on track to expand its production capacity for ABF substrates by 30-40% in 2022, and by another 40% in 2023, to meet ever-increasing demand for processing diverse high-performance computing (HPC) chips for PC and datacenter...

The article requires paid subscription. Subscribe Now