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Kinsus to expand production capacity for ABF substrates in 2022, 2023

Jay Liu, Taipei; Willis Ke, DIGITIMES Asia Thursday 17 February 2022 0

Credit: Kinsus

Kinsus Interconnect Technology is on track to expand its production capacity for ABF substrates by 30-40% in 2022, and by another 40% in 2023, to meet ever-increasing demand for processing diverse high-performance computing (HPC) chips for PC and datacenter...

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