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Nvidia to embrace TSMC 3D SoIC tech

Julian Ho, Taipei; Jessie Shen, DIGITIMES Asia Friday 7 April 2023 0

Credit: DIGITIMES

Nvidia is expected to use TSMC's 3D SoIC (system on integrated chips) stacking and chiplet packaging technology in its high-end processors set to debut between 2024 and 2025, according to sources in the IC backend market.

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