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WinWay Technology takes the lead in CPO, silicon photonics advanced packaging

Julian Ho, Taipei; Julie Chang, DIGITIMES Asia Wednesday 25 October 2023 0

Credit: DIGITIMES

High-speed data transmission has come into the spotlight along with cloud-based AI accelerator chips as one of the most vital capabilities in the electronics industry, and silicon photonics advanced packaging, co-package optics (CPO), has risen to the...

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