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TSMC and Amkor collaboration completes key puzzle piece in US chip manufacturing

Jerry Yang, Taipei; Jack Wu, DIGITIMES Asia Wednesday 9 October 2024 0

Credit: AFP

Amkor, a major US semiconductor packaging and testing company, received a US$400 million subsidy under the CHIPS Act to build a new plant in late July and will collaborate with TSMC on advanced chip packaging in the US for the first time. This marks...

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