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TSMC, Amkor sign MOU for advanced packaging at US facility, Apple to be first customer

Monica Chen, Hsinchu; Levi Li, DIGITIMES Asia Friday 4 October 2024 0

Credit: DIGITIMES

TSMC and Amkor Technology, the world's second-largest semiconductor packaging and testing firm, announced on October 4 the signing of a memorandum of understanding (MOU) to deliver advanced packaging and testing services in Arizona. This collaboration...

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