Atotech, MKS Instruments' globally leading brand in surface-finishing solutions, will participate in one of the most important PCB events, the 25th Taiwan Circuit Industry International Exhibition (TPCA Show) and International Microsystems, Packaging, Assembly and Circuits Technology Conferences (IMPACT) to be held in Taipei, Taiwan from October 23-25, 2024.
We will present the combined new product offering of the strategic brands Atotech (process chemicals, equipment, software, and services) and ESI (laser via drilling systems) to provide leading manufacturing solutions for printed circuit boards and package substrate manufacturing.
By combining our leading capabilities in lasers, optics, motion, process chemistry, and equipment, MKS is best positioned to Optimize the Interconnect, a significant enabling point of next-generation advanced electronics that represents the next frontier for miniaturization and complexity. Our Optimize the Interconnect philosophy highlights our unique position in supporting the development of next-generation advanced PCB and package substrates for our customers and partners. We are committed to enabling new technologies as well as increasingly smaller feature sizes by combining MKS' ESI laser drilling technologies with MKS' Atotech chemistry and plating equipment.
MKS' Atotech and ESI teams will be represented by a distinguished group of industry and technology experts from diverse sectors. They will be available at booth K-915 to discuss the latest trends and challenges facing the industry. Attendees can also learn about our integrated product offerings, which include PCB production equipment – such as wet-to-wet process equipment, laser systems, and auxiliary tools - alongside our advanced chemistry, software, and service solutions.
Product highlights at the show
Eddy Chen, Marketing Manager-EL Gr. China at MKS' Atotech, expressed, "We are pleased to announce our continued partnership in hosting the IMPACT industrial forum this year. During these sessions, we will focus on advanced AI packages and the transition from organic materials to glass core, and process solutions for advanced printed circuit boards (PCBs) that meet the growing requirements of AI package manufacturing. Furthermore, our experts from Atotech and ESI will present six related papers at the conference scheduled for October 23, 24, and 25."
IMPACT - MKS' Atotech industrial forum: Advancing AI chips from silicon to PCB
MKS' Atotech IMPACT Technical Conference Participation
MKS | Atotech | ESI Booth: K-915
For more information please visit: TPCA Show 2024
