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SiP emerging as mainstream packaging process in 5G, AIoT era

Julian Ho, Taipei; Willis Ke, DIGITIMES Asia Wednesday 21 November 2018 0

System in package (SiP) will continue to gain momentum to become the mainstream IC packaging process in the future as it can further complete heterogeneous integration of diverse chip solutions needed in the 5G and AIoT era, according to industry sou...

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